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EUV has 13.5nm as its wavelength, which is much smaller than the wavelength used in ArF lithography, and this gives very different imaging challenges compared to the ArF case. Due to the small wavelength and numerical aperture (NA) of the current EUV tools, depth of focus is not as significant of a concern as in DUV. Instead, EUV lithography is severely challenged by stochastic effects, which are directly linked to the slope of the intensity curve. DUV SRAF has been shown to be a powerful tool for improving NILS/ILS, as well as DOF, and here we explore how that translates into EUV imaging. In this paper, we consider Process Variability (PV) Bands with a variety of process conditions including focus/dose/mask bias changes and also the NILS/ILS as our objective functions, to determine what the best SRAF solution is for a set of test patterns. We have full investigations on both symmetric SRAF and asymmetric SRAF.
SRAF can potentially mitigate image shift through focus, i.e. non-telecentricity, caused by EUV 3D shadowing effect. This shadowing effect is pattern dependent and contributes to the overlay variation. As we approach the next generation beyond 7nm node, this image shift can be more significant relative to the overlay budget, hence we further investigate the impact of SRAF placement to the image shift. Moreover, the Center of Focus shift due to the large 3D mask absorber thickness can be potentially mitigated by SRAF implementation. The common process window is significantly impacted by both the center of focus shift and the individual depth of focus. We study the change by adding SRAF using both a symmetric source (standard source) and an asymmetric source (SMO source). Once SRAF is inserted for the test patterns, the common process window is plotted to compare the solutions with and without SRAF.
Finally, we understand the importance of using full flare map and full through slit model (including aberration variation through slit) in the main feature correction, but in this paper, we will further evaluate the need of using full models in SRAF insertion. This is a necessary step to determine the strategy of SRAF implementation for the next generation beyond 7nm node.
The simulation results are presented for both the traditional chemically amplified EUV resists and resists utilizing alternative mechanisms of image formation, such as metal based- resists.
Repeated measurements of the same structure at separate locations are used to extract SEM contours across several instances. The average measurements from these locations can then be used for OPC model calibration. Using 14nm process data, it is shown that including more contours in hybrid OPC model calibration leads to improved model verification. Within an appropriate range, higher weight on the contour patterns leads to improved model verification on measurement sites unseen by the calibration set. Calibrating a model with fewer contour structures, but at higher weight shows improvement over standard CD only model calibration.
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