Mr. Alexander C. Wei Profile

Alexander C. Wei

Application Engineer at Siemens

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Author

Publications (22)

Proceedings Article | 26 March 2019 Presentation + Paper

Implementation of different cost functions for EUV mask optimization for next generation beyond 7nm

Fan Jiang, Alexander Tritchkov, Alex Wei, Srividya Jayaram, Yuyang Sun, Xima Zhang, James Word

Proceedings Volume 10957, 1095712 (2019) https://doi.org/10.1117/12.2513560

KEYWORDS: SRAF, Image quality, Extreme ultraviolet, Extreme ultraviolet lithography, Photomasks, Lithography

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As the technology node gets smaller and smaller, the benefit from Sub-Resolution Assist Features (SRAF) becomes significant in EUV lithography which makes SRAFs a must-have tool for next generation beyond 7nm technology. When considering EUV specific effects, the metrics that need to be accounted for include Image Log-Slope (ILS), Process Variability (PV Band), common Depth of Focus (cDOF), and Image Shift (ImS) through focus. When these critical factors are accounted for during the EUV mask generation the optimization become much more complicated and challenging and necessitates the need for SRAFs beyond 7nm. SRAF helps enhance not only the PV Band, but more importantly helps boost the ILS, which is one of the key factors for improving stochastic effect in EUV. However, ILS is just one of the important image quality metric that we should focus on. For metal layers, Image Shift is another key factor which can have a big impact on overlay. ImS at the nominal condition could be compensated by Optical Proximity Correction (OPC), but image shift through focus can hardly be tuned by the main feature correction. The image shift through focus can be mitigated by SRAF insertion. Strong 3D mask effects can cause best focuses of different patterns to be far apart in EUV, which can cause an unusable cDOF even when the individual depth of focus values of all the patterns are not bad. SRAFs can be inserted to improve the individual depth of focus and align the best focuses together to help enhance the common process window. When taking account of various different EUV specific metrics mentioned above, then the most critical question for the next generation beyond 7nm is “How to define the cost function for mask optimization with SRAFs?” (Figure 1, EUV mask optimization flow for next generation beyond 7nm). In this study the image quality metrics including ILS, PVBand, cDOF, and ImS are evaluated. For each optimization schema using different cost functions, we examine the cost function metric and its impact on the other image quality metrics. We also present the potential trade-offs together with the analysis. Furthermore, multiple cross cost functions are defined for SRAF optimization and the results are analyzed accordingly. Both contact and metal layer patterns representing next generation beyond 7nm design rules are investigated. In our testing, symmetric standard sources from ASML NXE3400 is examined and the results are compared and analyzed.

Proceedings Article | 22 October 2018 Presentation + Paper

Lithographic benefits and mask manufacturability study of curvilinear masks

Vivian Wei Guo, Fan Jiang, Jed Rankin, Ingo Bork, Alexander Tritchkov, Alexander Wei, Yuyang Sun, Srividya Jayaram, Larry Zhuang, Xima Zhang, Todd Bailey, James Word

Proceedings Volume 10810, 108100P (2018) https://doi.org/10.1117/12.2501973

KEYWORDS: Photomasks, SRAF, Printing, Lithography, Vestigial sideband modulation, Semiconducting wafers, Optical proximity correction, Manufacturing, Image quality, Image processing

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Proceedings Article | 28 March 2018 Presentation + Paper

Combinational optical rule check on hotspot detection

Alexander Wei, Shaowen Gao, Yuansheng Ma, Shumay Shang, Yuyang Sun, Rui Wu, Lianghong Yin, Hongxin Zhang

Proceedings Volume 10588, 105880K (2018) https://doi.org/10.1117/12.2297425

KEYWORDS: Optical proximity correction, Failure analysis, Semiconducting wafers, Calibration, Data modeling, Photomasks, Inspection, Optics manufacturing, Bridges, Finite element methods

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Proceedings Article | 5 October 2016 Paper

Suppressing rippling with minimized corner rounding through OPC fragmentation optimization

Jingyu Wang, Alexander Wei, William Wilkinson, Norman Chen

Proceedings Volume 9985, 998528 (2016) https://doi.org/10.1117/12.2241409

KEYWORDS: Optical proximity correction, Optical lithography, Semiconducting wafers, Wafer-level optics, Image segmentation, Photomasks, Lithography, Edge roughness, Image resolution, Imaging systems

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Proceedings Article | 4 September 2015 Paper

Optimization of rule-based OPC fragmentation to improve wafer image rippling

Jingyu Wang, Alexander Wei, Piyush Verma, William Wilkinson

Proceedings Volume 9661, 96610D (2015) https://doi.org/10.1117/12.2194755

KEYWORDS: Optical proximity correction, Photomasks, Semiconducting wafers, Solids, Lithography, Diffraction, Wafer-level optics, Image segmentation, Imaging systems, Signal processing

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Proceedings Article | 8 October 2014 Paper

Conducting OPC retargeting as guided by principles of classical dynamics

Jingyu Wang, Piyush Verma, Alexander Wei, William Wilkinson

Proceedings Volume 9235, 923507 (2014) https://doi.org/10.1117/12.2067814

KEYWORDS: Optical proximity correction, Semiconducting wafers, Photomasks, Visualization, Lithography, Metals, Calibration, Solids, Patents, Shape analysis

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Proceedings Article | 12 April 2013 Paper

Enabling reverse tone imaging for via levels using attenuated phase shift mask and source optimization

Bassem Hamieh, Hyun Chol Choi, Burcin Erenturk, Wei Guo, Ayman Hamouda, Huikan Liu, Gregory McIntyre, Jason Meiring, David Moreau, Alan Thomas, Alexander Wei

Proceedings Volume 8683, 86830J (2013) https://doi.org/10.1117/12.2011349

KEYWORDS: Photomasks, Source mask optimization, Printing, Data modeling, SRAF, Phase shifts, Photovoltaics, Image processing, Nanoimprint lithography, Binary data

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Proceedings Article | 23 March 2011 Paper

Applicability of global source mask optimization to 22/20nm node and beyond

Kehan Tian, Moutaz Fakhry, Aasutosh Dave, Alexander Tritchkov, Jaione Tirapu-Azpiroz, Alan Rosenbluth, David Melville, Masaharu Sakamoto, Tadanobu Inoue, Scott Mansfield, Alexander Wei, Young Kim, Bruce Durgan, Kostas Adam, Gabriel Berger, Gandharv Bhatara, Jason Meiring, Henning Haffner, Byung-Sung Kim

Proceedings Volume 7973, 79730C (2011) https://doi.org/10.1117/12.879703

KEYWORDS: Source mask optimization, Photomasks, Resolution enhancement technologies, Optical proximity correction, Tolerancing, Optical lithography, SRAF, Image processing, Lithography, Semiconducting wafers

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Proceedings Article | 1 November 2007 Paper

The effect of the OPC parameters on the performance of the OPC model

Amr Abdo, Ahmed Seoud, Alexander Wei, Ian Stobert, Alan Leslie

Proceedings Volume 6730, 673055 (2007) https://doi.org/10.1117/12.746696

KEYWORDS: Optical proximity correction, Performance modeling, Optimization (mathematics), Critical dimension metrology, Resolution enhancement technologies, Photomasks, Integrated circuits, Lithography, Systems modeling, Optics manufacturing

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Proceedings Article | 5 April 2007 Paper

OPC model data collection for 45-nm technology node using automatic CD-SEM offline recipe creation

Daniel Fischer, Mohamed Talbi, Alex Wei, Ovadya Menadeva, Roger Cornell

Proceedings Volume 6518, 65181E (2007) https://doi.org/10.1117/12.712718

KEYWORDS: Optical proximity correction, Metrology, Data modeling, Pattern recognition, Semiconducting wafers, Reticles, Time metrology, Target recognition, Optical lithography, Quality measurement

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SPIE Journal Paper | 1 January 2006

Modeling and experimental investigation of bubble entrapment for flow over topography during immersion lithography

Holly Burnett, Alexander Wei, Mohamed El-Morsi, Timothy Shedd, Gregory Nellis, Chris Van Peski, Andrew Grenville

JM3, Vol. 5, Issue 01, 013008, (January 2006) https://doi.org/10.1117/12.10.1117/1.2158818

KEYWORDS: Semiconducting wafers, Immersion lithography, Liquids, Quartz, Image processing, Microfluidics, Cameras, Glasses, Fluid dynamics, Calcium

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SPIE Journal Paper | 1 January 2005

Simulation of the coupled thermal/optical effects for liquid immersion nanolithography

So-Yeon Baek, Alexander Wei, Daniel Cole, Gregory Nellis, Michael Yeung, Amr Abdo, Roxann Engelstad, Mordechai Rothschild, Michael Switkes

JM3, Vol. 4, Issue 01, 013002, (January 2005) https://doi.org/10.1117/12.10.1117/1.1858331

KEYWORDS: Semiconducting wafers, Liquids, Thermal effects, Microfluidics, Wafer-level optics, Refraction, Computational fluid dynamics, Optical lithography, Microfluidic imaging, Photomasks

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Proceedings Article | 6 December 2004 Paper

Modeling and experimental investigation of bubble entrainment for flow over topography during immersion lithography

Holly Burnett, Alexander Wei, Mohamed El-Morsi, Timothy Shedd, Gregory Nellis, Benjamin Spike, Chris Van Peski, Andrew Grenville, Roxann Engelstad

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.569295

KEYWORDS: Semiconducting wafers, Immersion lithography, Liquids, Cameras, Fluid dynamics, Nitrogen, Image processing, Imaging systems, Refractive index, Water

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Proceedings Article | 6 December 2004 Paper

Gas flow modeling for focused ion beam (FIB) repair processes

Mohamed El-Morsi, Alexander Wei, Gregory Nellis, Roxann Engelstad, Sybren Sijbrandij, Diane Stewart, Hans Mulders

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.570268

KEYWORDS: Ion beams, 3D modeling, Systems modeling, Process modeling, Photomask technology, Photomasks, Gases, Computational fluid dynamics, Computing systems, Statistical modeling

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Proceedings Article | 2 June 2004 Paper

Predicting microfluidic response during immersion lithography scanning

Alexander Wei, Gerald Dicks, Amr Abdo, Gregory Nellis, Roxann Engelstad, Jaehyuk Chang, Edward Lovell, William Beckman

Proceedings Volume 5504, (2004) https://doi.org/10.1117/12.568024

KEYWORDS: Liquids, Semiconducting wafers, Immersion lithography, Polymers, Microfluidics, Refraction, Absorption, Optical simulations, Refractive index, Wafer-level optics

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Proceedings Article | 28 May 2004 Paper

Simulation of the coupled thermal optical effects for liquid immersion micro-/nano-lithography

So-Yeon Baek, Alexander Wei, Daniel Cole, Greg Nellis, Michael Yeung, Amr Abdo, Roxann Engelstad

Proceedings Volume 5377, (2004) https://doi.org/10.1117/12.537574

KEYWORDS: Semiconducting wafers, Liquids, Thermal effects, Protactinium, Wafer-level optics, Refraction, Computational fluid dynamics, Microfluidics, Immersion lithography, Microfluidic imaging

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SPIE Journal Paper | 1 January 2004

Microfluidic simulations for immersion lithography

Alexander Wei, Gregory Nellis, Amr Abdo, Roxann Engelstad, Cheng-Fu Chen, Michael Switkes, Mordechai Rothschild

JM3, Vol. 3, Issue 01, (January 2004) https://doi.org/10.1117/12.10.1117/1.1632500

KEYWORDS: Semiconducting wafers, Liquids, Microfluidics, Immersion lithography, Capillaries, Computational fluid dynamics, Fluid dynamics, Computer simulations, Calcium, Refraction

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SPIE Journal Paper | 1 January 2004

Preliminary analysis of laser-pulse-induced pressure variation for immersion lithography

Gregory Nellis, Alexander Wei

JM3, Vol. 3, Issue 01, (January 2004) https://doi.org/10.1117/12.10.1117/1.1636490

KEYWORDS: Pulsed laser operation, Immersion lithography, Semiconducting wafers, Wave propagation, Wavefronts, Refraction, Mechanical engineering, Heat flux, Interfaces, Photoresist materials

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Proceedings Article | 26 June 2003 Paper

Strategies for predictive control of chrome stress-induced registration errors

Alexander Wei, Gregory Hughes, Aaron Chalekian, Lawrence Mackey, Andrew Mikkelson, Roxann Engelstad

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485496

KEYWORDS: Photomasks, Image registration, Etching, Distortion, Optical lithography, Reticles, Yield improvement, Manufacturing, Chemical elements, Finite element methods

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Proceedings Article | 26 June 2003 Paper

Preliminary microfluidic simulation for immersion lithography

Alexander Wei, Greg Nellis, Amr Abdo, Roxann Engelstad, Cheng-Fu Chen, Michael Switkes, Mordechai Rothschild

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.497495

KEYWORDS: Semiconducting wafers, Liquids, Immersion lithography, Computational fluid dynamics, Microfluidics, Fluid dynamics, Computer simulations, Water, Liquid lenses, Process modeling

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Proceedings Article | 1 July 2002 Paper

Thermomechanical modeling of the pin-chucked EUV reticle during exposure

Alexander Wei, Carl Martin, William Beckman, John Mitchell, Roxann Engelstad, Edward Lovell, Kenneth Blaedel

Proceedings Volume 4688, (2002) https://doi.org/10.1117/12.472349

KEYWORDS: Reticles, Extreme ultraviolet lithography, Extreme ultraviolet, Lithography, Particles, Helium, 3D modeling, Semiconducting wafers, Nitrogen, Thermal modeling

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Proceedings Article | 22 January 2001 Paper

Localized resist heating due to electron-beam patterning during photomask fabrication

Alexander Wei, William Beckman, Roxann Engelstad, John Mitchell, Thanh Phung, Jun-Fei Zheng

Proceedings Volume 4186, (2001) https://doi.org/10.1117/12.410727

KEYWORDS: Electron beam lithography, Picosecond phenomena, Photomasks, Optical lithography, Diffusion, Critical dimension metrology, Spatial resolution, Temperature metrology, Electron beams, Thermal effects

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Showing 5 of 22 publications

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