Dr. Harun H. Solak Profile

Dr. Harun H. Solak

CEO at Eulitha AG

SPIE Involvement:

Author

Profile Summary

Eulitha provides nanolithography services and equipment for research and production. Its revolutionary PHABLE photolithography systems enable low-cost fabrication of periodic nanostructures over large areas. This proprietary technology has wide ranging uses in photonics, optoelectronics, electronics, biotechnology, telecommunication, photovoltaics, sensors and other areas. Eulitha’s custom and standard ranges of nano-patterned substrates are made with electron-beam or its own PHABLE lithography.

Publications (19)

Proceedings Article | 10 April 2024 Presentation

Presentation

300mm+ substrate UV/DUV low-cost, reliable periodic patterning solution for high-volume manufacturing

Kelsey Wooley, Harun Solak, Christian Dais, Francis Clube, Ahmed Mohammad, Iuliia Bykova, Thibault Seure, Mehdi Heydari, Matthew Wilson, Li Wang

Proceedings Volume PC12956, PC129560O (2024) https://doi.org/10.1117/12.3013328

KEYWORDS: Optical lithography, Semiconducting wafers, Photomasks, Lithography, High volume manufacturing, Photonics, Ultraviolet radiation, Standards development, Projection lithography, Deep ultraviolet

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Proceedings Article | 10 April 2024 Presentation + Paper

Presentation + Paper

Simulating use of displacement Talbot lithography for high volume AR waveguide manufacturing

Kelsey Wooley, Maryvonne Chalony, Andrew M. Dawes, Zhixin Wang, Harun Solak, Lawrence Melvin

Proceedings Volume 12954, 1295414 (2024) https://doi.org/10.1117/12.3014541

KEYWORDS: Design, Optical gratings, Manufacturing, Eye, Lithography, Waveguides, Printing, Etching, Diffractive optical elements, Augmented reality

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Proceedings Article | 10 April 2024 Presentation + Paper

Presentation + Paper

Inverse lithography mask design of displacement Talbot lithography enabled by optimization method

Zhixin Wang, Li Wang, Harun Solak

Proceedings Volume 12954, 129540M (2024) https://doi.org/10.1117/12.3010197

KEYWORDS: Semiconducting wafers, Lithography, Design, Optical lithography, Scanning electron microscopy, Augmented reality, Inverse optics, Computational lithography, 193nm lithography, Source mask optimization, Machine learning

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Proceedings Article | 13 March 2024 Poster

Poster

Modeling tools for use of displacement Talbot lithography for high volume AR waveguide manufacturing

Kelsey Wooley, Andrew M. Dawes, Zhixin Wang, Maryvonne Chalony, Harun Solak, Lawrence Melvin

Proceedings Volume PC12913, PC129130R (2024) https://doi.org/10.1117/12.3003908

KEYWORDS: Waveguides, Modeling, Lithography, Augmented reality, Printing, Manufacturing, Autoregressive models, Optical lithography, Design and modelling, Optics manufacturing

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Proceedings Article | 21 November 2023 Presentation + Paper

Presentation + Paper

Displacement Talbot lithography process simulation analysis

Andrew M. Dawes, Zhixin Wang, Lawrence Melvin, Bernd Kuechler, Wolfgang Demmerle, Al Blais, Kelsey Wooley, Harun Solak

Proceedings Volume 12751, 127510C (2023) https://doi.org/10.1117/12.2690860

KEYWORDS: Printing, Lithography, Line edge roughness, Semiconducting wafers, Image transmission, Optical gratings, Light sources and illumination, Photoresist processing, Collimation, Optical lithography

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Proceedings Article | 16 November 2022 Presentation

Presentation

Production of AR/VR waveguides with displacement Talbot lithography

Harun Solak

Proceedings Volume PC12293, PC122930C (2022) https://doi.org/10.1117/12.2643318

KEYWORDS: Waveguides, Lithography, Printing, Diffraction gratings, Photomasks, Manufacturing, Image transmission, Virtual reality, Semiconducting wafers, Photoresist materials

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Proceedings Article | 4 October 2022 Presentation

Presentation

Displacement talbot lithography: a new and versatile technology for printing periodic nanostructures (Conference Presentation)

Harun Solak

Proceedings Volume PC12201, PC1220106 (2022) https://doi.org/10.1117/12.2635960

KEYWORDS: Printing, Nanostructures, Lithography, Optical lithography, Photonics, Semiconductors, Polarizers, Nanolithography, Laser applications, Eye

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Proceedings Article | 27 March 2017 Paper

Paper

High-aspect ratio silicon structures by displacement Talbot lithography and Bosch etching

Konstantins Jefimovs, Lucia Romano, Joan Vila-Comamala, Matias Kagias, Zhentian Wang, Li Wang, Christian Dais, Harun Solak, Marco Stampanoni

Proceedings Volume 10146, 101460L (2017) https://doi.org/10.1117/12.2258007

KEYWORDS: Lithography, Semiconducting wafers, Photomasks, Lithographic illumination, Reactive ion etching, Silicon, Phase contrast, X-ray imaging, Etching, Optical lithography, X-rays, Photoresist materials, Chromium

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Proceedings Article | 1 May 2012 Paper

Paper

High performance Al bi-layer wire-grid polarizer for deep-ultraviolet to infrared: modeling and design

Li Wang, Harun Solak, Yasin Ekinci

Proceedings Volume 8424, 842429 (2012) https://doi.org/10.1117/12.921837

KEYWORDS: Aluminum, Polarizers, Deep ultraviolet, Metals, Nanofabrication, Visible radiation, Infrared radiation, Polarization, Nanophotonics, Nanoimprint lithography

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Proceedings Article | 23 March 2010 Paper

Paper

Measuring resist-induced contrast loss using EUV interference lithography

Andreas Langner, Harun Solak, Roel Gronheid, Eelco van Setten, Vaida Auzelyte, Yasin Ekinci, Koen van Ingen Schenau, Kees Feenstra

Proceedings Volume 7636, 76362X (2010) https://doi.org/10.1117/12.846495

KEYWORDS: Nanoimprint lithography, Extreme ultraviolet lithography, Modulation transfer functions, Photomasks, Lithography, Silicon, Electroluminescence, Scanning electron microscopy, Diffraction gratings, Diffusion

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Proceedings Article | 1 April 2009 Paper

Paper

Lithographic evaluation and chemical modeling of acid amplifiers used in EUV photoresists

Robert Brainard, Craig Higgins, Seth Kruger, Srividya Revuru, Brian Cardineau, Sarah Gibbons, Dan Freedman, Harun Solak, Wang Yueh, Todd Younkin

Proceedings Volume 7273, 72733Q (2009) https://doi.org/10.1117/12.814308

KEYWORDS: Amplifiers, Line edge roughness, Lithography, Extreme ultraviolet lithography, Molecules, Oxygen, Thermal modeling, Thermodynamics, Photoresist materials, Polymers

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SPIE Journal Paper | 1 April 2009

Extreme ultraviolet interference lithography at the Paul Scherrer Institut

Vaida Auzelyte, Christian Dais, Patrick Farquet, Detlev Gruetzmacher, Laura Heyderman, Feng Luo, Sven Olliges, Celestino Padeste, Pratap Sahoo, Tom Thomson, Audrey Turchanin, Christian David, Harun Solak

JM3, Vol. 8, Issue 02, 021204, (April 2009) https://doi.org/10.1117/12.10.1117/1.3116559

KEYWORDS: Magnetism, Extreme ultraviolet lithography, Lithography, Extreme ultraviolet, Polymers, Photomasks, Gold, Proteins, Nanolithography, Nanowires

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Proceedings Article | 26 March 2007 Paper

Paper

Exposure of molecular glass resist by e-beam and EUVIL

Cyril Vannuffel, Damien Djian, Serge Tedesco, Dimitra Niakoula, Panagiotis Argitis, Veroniki Vidali, Elias Couladouros, Harun Solak

Proceedings Volume 6519, 651949 (2007) https://doi.org/10.1117/12.714263

KEYWORDS: Head-mounted displays, Line edge roughness, Cadmium sulfide, Glasses, Molecules, Lithography, Extreme ultraviolet lithography, Photoresist processing, Electron beam lithography, Diffusion

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Proceedings Article | 29 March 2006 Paper

Paper

Overcoming pattern collapse on e-beam and EUV lithography

A. Jouve, J. Simon, A. Pikon, H. Solak, C. Vannuffel, J.-H. Tortai

Proceedings Volume 6153, 61531C (2006) https://doi.org/10.1117/12.656400

KEYWORDS: Electron beam lithography, Capillaries, Liquids, Adhesives, Extreme ultraviolet lithography, Interfaces, Lithography, Polymers, Chemically amplified resists, Extreme ultraviolet

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Proceedings Article | 4 May 2005 Paper

Paper

Overcoming pattern collapse of ultra high resolution dense lines obtained with EUV resists

A. Jouve, J. Simon, J. Foucher, T. David, J.-H. Tortai, Harun Solak

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.598763

KEYWORDS: Electron beam lithography, Lithography, Extreme ultraviolet lithography, Extreme ultraviolet, Line width roughness, Photoresist processing, Liquids, Thin films, Line edge roughness, Etching

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Future lithography tools will have to address the 32 nm node. EUV lithography at 13.4 nm wavelength is the technology that may achieve such resolution if chemically amplified EUV resists show high enough resolution capabilities. However for sub 100 nm line width patterns, the pattern collapse, generated during the drying step of the developing process, becomes a serious limiting phenomenon. We performed ultra high resolution exposures of EUV positive chemically amplified resists using either electron beam lithography (EBL), or EUV interferometry Lithography (IL) produced in a synchrotron. Two theoretical models have been compared with experimental results. One is mainly dealing with adhesion failure and the other with the line deformation. Adhesion failure occurs when capillarity pressure on the pattern become stronger than the attractive Van der Walls forces assuring the pattern adhesion on the substrate. Mechanical failure occurs once the lines deflection exceeds the mechanical breaking resistance of the resist. We highlighted that pattern collapse mode depends on resist thickness. Collapsing of patterns with thickness>100 nm are properly fitted with the deformation model of the resist; whereas for pattern height under 60 nm, experimental results obtained by EUVIL and EBL are properly predicted with the adhesion failure model. To push resolution further and avoid pattern collapse, we targeted to expose sub 100 nm thick resist films. AFM3D measurements on EBL patterns show that reducing the resist thickness increases their top Line Width Roughness (LWR) testifying of physical resist properties variations in the resist interfacial layers. However we pointed out an optimum resist thickness, hence an optimal dilution. By tuning developer normality and puddle time, straight resist profiles were obtained. Finally we reached dense 40/40 nm lines in XP9947W150 resist using both exposure tools and validate the process compatibility with future etching steps by transferring 40/40 nm dense lines patterned with EBL into a metallic hard mask.

Proceedings Article | 13 December 2001 Paper

Paper

Diffractive lenses for photon energies ranging from the extreme ultraviolet to hard x rays

Christian David, Bernd Noehammer, Harun Solak, Bianca Haas, Fredy Glaus, J. Friso van der Veen, Volker Schlott, Jeroen Bongaerts, Burkhard Kaulich, Jean Susini

Proceedings Volume 4499, (2001) https://doi.org/10.1117/12.450225

KEYWORDS: Zone plates, Diffraction, Silicon, X-rays, X-ray optics, Energy efficiency, Absorption, Waveguides, Synchrotrons, Chromium

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Proceedings Article | 21 July 2000 Paper

Paper

EUV nanolithography: sub-50-nm L/S

Wai-Kin Li, Harun Solak, Franco Cerrina

Proceedings Volume 3997, (2000) https://doi.org/10.1117/12.390120

KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Mirrors, Lithography, Semiconducting wafers, Interferometry, Etching, Silicon, Gold, Nanolithography

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Proceedings Article | 25 June 1999 Paper

Paper

EUV interferometric lithography for resist characterization

Harun Solak, Dongxing He, Wai-Kin Li, Franco Cerrina, B. Sohn, Xiao Yang, Paul Nealey

Proceedings Volume 3676, (1999) https://doi.org/10.1117/12.351099

KEYWORDS: Lithography, Interferometry, Mirrors, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist materials, Printing, Fringe analysis, Photoresist developing, Multilayers

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Proceedings Article | 5 June 1998 Paper

Paper

EUV mask absorber defect size requirement at 100-nm design rules

Pei-yang Yan, Guojing Zhang, Jenn Chow, Patrick Kofron, Joseph Langston, Harun Solak, Patrick Kearney, Gregory Cardinale, Kurt Berger, Craig Henderson

Proceedings Volume 3331, (1998) https://doi.org/10.1117/12.309627

KEYWORDS: Photomasks, Critical dimension metrology, Opacity, Semiconducting wafers, Process control, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist processing, Scanning electron microscopy, Metals

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Showing 5 of 19 publications

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