Dr. Jeong-Gil Kim Profile

Dr. Jeong-Gil Kim

at SAMSUNG Electronics Co Ltd

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 10 April 2024 Presentation + Paper

Advanced wafer engineering for minimizing overlay: tailoring and reducing wafer stress and distortion

Jong-Gu Lee, Hyeon-Jin Kim, JinMan Kim, HongJu Kim, Seok Heo, HaRam Ko, SungBin Jeon, YoungHa Kim, Jinhong Park, Hyunjae Kang, Jeong-Gil Kim

Proceedings Volume 12954, 129540D (2024) https://doi.org/10.1117/12.3010045

KEYWORDS: Semiconducting wafers, Wafer bonding, Distortion, Overlay metrology, Matrices, Deformation, Engineering, Crystals, Chemical mechanical planarization, Silicon

Read Abstract +

We suggest advanced wafer engineering (i.e. Angle-ply Laminating Wafers(ALW)) which aim to tailoring and reducing wafer stress and distortion, in order to improve In-Cell Overlay(ICO) and On-Product Overlay(OPO). Especially, we focus ~nm devices adapting 3D-interconnection technology and scheme. In 3D-interconnection technology and scheme, Wafer to Wafer(W2W) bonding process are necessary harnessed. Unfortunately, it naturally induce large stress and distortion which are very sensitive to extrinsic and intrinsic property of wafer(i.e. initial warpage, thin film profile, wafer modulus). These wafer stress and distortion become a high risk in reducing overlay, as the cell size of device shrink. Thus, in development of ~nm devices, main key is to find effective and efficient method of wafer engineering reducing wafer stress and distortion. In order to handle this risk, we suggest and develop Angle-ply Laminating Wafers with heterogeneous crystal-structure, which is based on Classical Lamination Plate Theory(CLPT) in the area of advanced solid mechanics. By utilizing this design concept, anisotropic modulus of top and bottom wafer balance under W2W bonding process. As a result, it induce stress relaxation, distortion and reduce overlay. To verify it rigorously, we introduce the wafer stiffness tailoring method based on CLPT; and construct the simulation model predicting the W2W bonding distortion and photo overlay. We develop the W2W bonding simulation model based on framework of multiscale analysis and pre-verified by comparing with experiment results, which relate to the initial warpage effect on overlay and the thin film profile effect on bondability. Finally, we predict and analyze the effect of angle-ply laminating wafers with respect to a diverse combination of heterogeneous crystal-structure and stacking angle.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years