Dr. Young Ha Kim Profile

Dr. Young Ha Kim

Principal Engineer at SAMSUNG Electronics Co Ltd

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Author

Publications (8)

Proceedings Article | 10 April 2024 Presentation + Paper

Advanced wafer engineering for minimizing overlay: tailoring and reducing wafer stress and distortion

Jong-Gu Lee, Hyeon-Jin Kim, JinMan Kim, HongJu Kim, Seok Heo, HaRam Ko, SungBin Jeon, YoungHa Kim, Jinhong Park, Hyunjae Kang, Jeong-Gil Kim

Proceedings Volume 12954, 129540D (2024) https://doi.org/10.1117/12.3010045

KEYWORDS: Semiconducting wafers, Wafer bonding, Distortion, Overlay metrology, Matrices, Deformation, Engineering, Crystals, Chemical mechanical planarization, Silicon

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Proceedings Article | 24 March 2017 Paper

Reticle heating feed-forward control (RHC2) on NXT:1980Di immersion scanner for enhanced on-product overlay

Young Ha Kim, Jonghoon Jang, Byeong Soo Lee, Hyunwoo Hwang, Youngsun Nam, Jeong-Heung Kong, Young Seog Kang, Se-Yeon Jang, Bart Paarhuis, Jeroen van der Wielen, Barry Moest, Joris Jongen, Stefan Weichselbaum, Niek Verbeek, Marco Stavenga, Roelof de Graaf, Richard Droste

Proceedings Volume 10147, 1014717 (2017) https://doi.org/10.1117/12.2259792

KEYWORDS: Reticles, Scanners, Distortion, HVAC controls, Optical alignment, Control systems, Thermal effects, Temperature metrology, Semiconducting wafers, Overlay metrology, Calibration

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Scanners in High-Volume-Manufacturing conditions will experience a large range of reticles that vary in reticle transmission and reticle diffraction characteristics. Especially under full production loads reticles will heat up due to the exposure light-load and as such experience thermo-mechanical deformations. The resulting reticle pattern distortion can be partially translated in a deteriorated overall system overlay. Due to the geometry of the reticle and exposure fields, these reticle thermal effects are in general barrel-shape distortions that can be well corrected with the available set of lens manipulators. Nevertheless node-over-node the residual overlay errors associated with thermo-mechanical reticle deformation needs further reduction since it contributes to the total onproduct overlay performance. To reduce overlay caused by reticle temperature drift, NXT1980Di includes an active cooling mechanism suppressing the reticle temperature changes during exposure significantly. Even though the reticle temperature excursions are well suppressed, residual intra-wafer overlay drift effect can still be observed. Before exposure of a wafer, reticle deformation is measured during reticle align using in-line alignment / image sensors (TIS or PARIS). This is enabled by adding alignment markers around the circumference of the image field on the reticle. The measured reticle deformations are then fed to the system control network and dynamically corrected for by making use of the available manipulators in the scanner and the projection lens. Wafer-by-wafer reticle distortion measurements are performed to accurately capture the transient dynamics present in reticle heating during normal production lots. A new version of Reticle Heating Feed-forward Control (RHC2) is introduced that uses reticle-heating-induced deformation measurements over time and exposure sequence information to calibrate reticle-deformation-predictionmodels. These models are based on thermo-mechanical models that simulate reticle deformation under various exposure conditions and are applied in-line to the exposures to reduce intra-wafer overlay drift effects.

Proceedings Article | 24 March 2017 Presentation + Paper

Layout independent leveling (LIL) on NXT:1980Di immersion scanners for enhanced productivity

Bram van Hoof, Arjan Holscher, Ralf Gommers, Jeroen Cottaar, Marcel Raas, Samah Khalek, Jan van Kemenade, Maarten Voncken, Roelof de Graaf, Elliot Oti, Stefan Weichselbaum, Richard Droste, ByeongSoo Lee, Chansam Chang, Young Seog Kang, Young Ha Kim, Jeong-Heung Kong, Jong Hoon Jang, YoungSun Nam, Hyunwoo Hwang

Proceedings Volume 10147, 101471A (2017) https://doi.org/10.1117/12.2259794

KEYWORDS: Semiconducting wafers, Sensors, Time metrology, Scanners, Optical alignment, Calibration, Wafer testing, Overlay metrology, Metrology, Computer programming

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SPIE Journal Paper | 29 March 2016

High-order distortion control using a computational prediction method for device overlay

Young Seog Kang, Cedric Affentauschegg, Jan Mulkens, Jang-Sun Kim, Ju Hee Shin, Young Ha Kim, YoungSun Nam, Young-Sin Choi, Hunhwan Ha, Dong-Han Lee, Jae-il Lee, Umar Rizvi, Bernd Geh, Rob van der Heijden, Jan Baselmans, Oh-Sung Kwon

JM3, Vol. 15, Issue 02, 021403, (March 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.2.021403

KEYWORDS: Overlay metrology, Metrology, Distortion, Control systems, Semiconducting wafers, Scanners, Etching, Information technology, Image processing, Photomasks

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Proceedings Article | 15 March 2016 Paper

Improvement of unbalanced illumination induced telecentricity within the exposure slit

Jonghoon Jang, ByeongSoo Lee, Young Seog Kang, Chansam Chang, Jeong-Heung Kong, Young Ha Kim, Wim Bouman, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Wim de Boeij, Bart van Bussel, Patrick Neefs, Arij Rijke

Proceedings Volume 9780, 97800X (2016) https://doi.org/10.1117/12.2220588

KEYWORDS: Lithography, Lithographic illumination, Optical alignment, Scanners, Optical lithography, Image enhancement, Reticles, Electronics

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Proceedings Article | 15 March 2016 Paper

Overcoming low-alignment signal contrast induced alignment failure by alignment signal enhancement

Byeong Soo Lee, Young Ha Kim, Hyunwoo Hwang, Jeongjin Lee, Jeong Heung Kong, Young Seog Kang, Bart Paarhuis, Haico Kok, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Christopher Mason, Igor Aarts, Wim de Boeij

Proceedings Volume 9780, 97800B (2016) https://doi.org/10.1117/12.2220587

KEYWORDS: Optical alignment, Signal processing, Overlay metrology, Optical lithography, Optics manufacturing, Opacity, Materials processing, Sensors, Wafer testing, Near infrared, Image processing

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Proceedings Article | 18 March 2015 Paper

Solution for high-order distortion on extreme illumination condition using computational prediction method

Young-Seog Kang, Hunhwan Ha, Jang-Sun Kim, Ju Hee Shin, Young Ha Kim, Young Sun Nam, Young-Sin Choi, Cedric Affentauschegg, Rob van der Heijden, Umar Rizvi, Bernd Geh, Eric Janda, Jan Baselmans, Stefan van der Sanden, Oh-Sung Kwon, Mariya Ponomarenko, Daan Slotboom

Proceedings Volume 9426, 942608 (2015) https://doi.org/10.1117/12.2086938

KEYWORDS: Overlay metrology, Distortion, Etching, Metrology, Image processing, Instrument modeling, Data modeling, Calibration, Photomasks, Measurement devices

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Proceedings Article | 31 March 2014 Paper

Analysis of overlay errors induced by exposure energy in negative tone development process for photolithography

Young Ha Kim, Jang-Sun Kim, Young-Hoon Kim, Byeong-Ok Cho, Jinphil Choi, Young Seog Kang, Hunhwan Ha

Proceedings Volume 9052, 90520V (2014) https://doi.org/10.1117/12.2046265

KEYWORDS: Semiconducting wafers, Photomasks, Overlay metrology, Error analysis, Image processing, Optical lithography, Photoresist processing, Lithography, Double patterning technology, Image contrast enhancement

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Showing 5 of 8 publications

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