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In most optomechanical systems, the resonance frequency of an optical cavity is shifted due to the oscillations of a mechanical resonator, which is in turn put into motion through optical forces such as radiation pressure or optical gradient forces. This interaction is quantified by the said optomechanical vacuum coupling rate, that is a measurement of the interaction between a single photon and phonon. Increasing this factor is mandatory for both quantum and classical applications. In order to do so, low volume and high quality factors cavities and resonators are required. The optomechanical strength is also proportional to the intra-cavity power, and it is then advantageous to avoid any non-linear or thermal effect to insure the stability of the system.
Here, we investigate the use of sub-wavelength grating (SWG) structures as a way to induce optomechanical coupling. This paper will present the design, realization, and characterization of various geometries fabricated on standard SOI wafers and working over the telecom C-band. We expect a strong optomechanical vacuum coupling rate, that we believe will open new perspectives towards highly sensitive and stable on-chip optomechanical systems, optical signal processing, or even quasi room temperature back-action cooling.
Progress in Cascade Laser technology (QCL and ICL) allows to select emission wavelengths suitable to target the detection of specific chemicals. With these sources, novel spectroscopic tools allowing real-time in-situ detection of gasses down to traces are nowadays commercially available.
Mid-IR Si photonics has developed a novel class of integrated components leading to the integration at chip level of the main building blocks required for chemical sensing, i.e. the source, the PICs and the detector. Three main directions of improvement can be drawn: i) extend the range of wavelengths available from a single source, ii) move beam handling and routing from discrete optics to PICs and iii) investigate detection schemes for a fully integrated on-chip sensing.
This paper reviews recent key achievements in the miniaturization and the co-integration of photonics devices at chip and packaging level to address cost, size and power consumption. Perspectives on potential applications will also be presented.
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