Paper
12 April 2013 Extending immersion lithography down to 1x nm production nodes
Wim P. de Boeij, Remi Pieternella, Igor Bouchoms, Martijn Leenders, Marjan Hoofman, Roelof de Graaf, Haico Kok, Par Broman, Joost Smits, Jan-Jaap Kuit, Matthew McLaren
Author Affiliations +
Abstract
In this paper we report on the performance enhancements on the NXT immersion scanner platform to support the immersion lithography roadmap. We particular discuss scanner modules that enable future overlay and focus requirements. Among others we describe the improvements in grid calibrations and grid matching; thermal control of reticle heating with dynamic systems adjustments; aberration tuning and FlexWave-lens heating control as well as aberration- and overlay-metrology on wafer-2-wafer timescales. Finally we address reduction of leveling process dependencies, stage servo dynamics and wafer table flatness to enhance on-product focus and leveling performance. We present and discuss module- and system-data of the above mentioned scanner improvements.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wim P. de Boeij, Remi Pieternella, Igor Bouchoms, Martijn Leenders, Marjan Hoofman, Roelof de Graaf, Haico Kok, Par Broman, Joost Smits, Jan-Jaap Kuit, and Matthew McLaren "Extending immersion lithography down to 1x nm production nodes", Proc. SPIE 8683, Optical Microlithography XXVI, 86831L (12 April 2013); https://doi.org/10.1117/12.2021397
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Cited by 15 scholarly publications.
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KEYWORDS
Reticles

Scanners

Semiconducting wafers

HVAC controls

Overlay metrology

Calibration

Sensors

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