Direct print extreme ultraviolet (EUV) has proven effective for pitch scaling and design rules flexibility. As feature size shrinks, stochastic noise poses challenges that demand innovative solutions. In this abstract, we present a novel approach known as pattern shaping , that not only addresses these challenges but also facilitates new opportunities for advanced patterning strategies. Integrating pattern shaping applications into the process flow reduces process complexity, eliminates the need for additional EUV patterning layers, paves the way for pushing lithographic print boundaries, and enhances the wafer yield. This accelerates the achievement of the technology readiness milestones.
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