As lithography patterning focus tolerance shrinkage in advanced production fab, defocus due to scanner wafer table or pre-layer contamination has been considered as a yield-loss killer and wafer scrap contributor. Traditionally, we can only apply a fixed by-wafer/by-zone spec to monitor leveling performance, lacking flexibility for further defense system design or root-cause analysis. In this paper we develop a comprehensive solution to capture focus/chuck spot in a high-volume manufacturing environment. This algorithm can automatically detect and categorize defocus spot into focus and chuck spots. Meanwhile, this algorithm produces an overlapped map for back-tracing pre-stage contamination and regularly send an alarm in customized schedule to prevent serious yield loss.
As semiconductor industry moves to advanced node, capability to well-control On Product Overlay (OPO) becomes a major task force in HVM environment in recent years. In order to continuously sustain OPO at better production level for critical layers, processing on one dedicated immersion (IMM) scanner is a traditional method to meet the quality purpose. However, the tool dedication method impacts IMM scanner throughput and therefore increases cost of ownership for the manufacturing. The ability of smoothly de-stacking the process layers to other IMM scanner without heavily losing OPO performance levels up the full-route productivity, hence enables the cost down opportunity. In this paper, we present a run-to-run APC control methodology and demonstrate the capability to well predict the model terms for inline production scenarios.
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