A study of vertical lithography for high-density 3D structures

Shin-Ichiro Hirai; Nobuyuki Saito; Yoshio Goto; Hiromi Suda; Ken-Ichiro Mori; Seiya Miura

doi:10.1117/12.917877

13 March 2012 A study of vertical lithography for high-density 3D structures

Shin-Ichiro Hirai, Nobuyuki Saito, Yoshio Goto, Hiromi Suda, Ken-Ichiro Mori, Seiya Miura

Proceedings Volume 8326, Optical Microlithography XXV; 83261E (2012) https://doi.org/10.1117/12.917877
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

3D stacking technology using TSVs, as well as linewidth shrinking, is crucial for future progress in semiconductor devices. A new i-line exposure tool, the FPA-5510iV, has been developed which provides the functions necessary for implementing TSV processes. This paper reports on Canon's commitment to make advanced TSV processes a reality.

Citation Download Citation

Shin-Ichiro Hirai, Nobuyuki Saito, Yoshio Goto, Hiromi Suda, Ken-Ichiro Mori, and Seiya Miura "A study of vertical lithography for high-density 3D structures", Proc. SPIE 8326, Optical Microlithography XXV, 83261E (13 March 2012); https://doi.org/10.1117/12.917877

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