Paper
26 March 2008 Formation mechanism of 193nm immersion defects and defect reduction strategies
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Abstract
The formation mechanism of various 193nm immersion-related defects is investigated. The experimental results are reviewed and compared to the simulation results, which enables us to form a clear picture of how the immersion defects are generated. Based on the understanding of defects mechanisms, a series of the defect reduction measures is proposed for the 193nm immersion process.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yayi Wei, Stefan Brandl, and Frank Goodwin "Formation mechanism of 193nm immersion defects and defect reduction strategies", Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69231Y (26 March 2008); https://doi.org/10.1117/12.771221
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Cited by 5 scholarly publications.
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KEYWORDS
Semiconducting wafers

Particles

Head

Scanning electron microscopy

Coating

Photoresist processing

Water

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