High-density packaging and interconnect of massively parallel image processors

John C. Carson; Ronald Indin

doi:10.1117/12.49338

1 November 1991 High-density packaging and interconnect of massively parallel image processors

John C. Carson, Ronald Indin

Proceedings Volume 1541, Infrared Sensors: Detectors, Electronics, and Signal Processing; (1991) https://doi.org/10.1117/12.49338
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Citation Download Citation

John C. Carson and Ronald Indin "High-density packaging and interconnect of massively parallel image processors", Proc. SPIE 1541, Infrared Sensors: Detectors, Electronics, and Signal Processing, (1 November 1991); https://doi.org/10.1117/12.49338

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