Micro-via fabrication of glass material for semiconductor packaging by 248 nm excimer laser

Yasufumi Kawasuji; Akira Suwa; Yasuhiro Adachi; Masakazu Kobayashi; Kouji Kakizaki; Masakazu Washio

doi:10.1117/12.2578038

5 March 2021 Micro-via fabrication of glass material for semiconductor packaging by 248 nm excimer laser

Yasufumi Kawasuji, Akira Suwa, Yasuhiro Adachi, Masakazu Kobayashi, Kouji Kakizaki, Masakazu Washio

Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 116730E (2021) https://doi.org/10.1117/12.2578038
Event: SPIE LASE, 2021, Online Only

Abstract

In this study, we are developing the process of glass ablation by 248nm excimer to make micro-via to the glass material. The interposer connects many pins between both sides electrically. Therefore, the micro-via to the glass substrate must be needed.　However, the micro-via machining to the glass material is difficult because the glass is brittle material. We report microdrilling processability of less than 20um diameter for glass material using a 248nm excimer laser. We also report the investigation result of the dependence of the drilling rate and laser fluence and laser pulse width.

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Citation Download Citation

Yasufumi Kawasuji, Akira Suwa, Yasuhiro Adachi, Masakazu Kobayashi, Kouji Kakizaki, and Masakazu Washio "Micro-via fabrication of glass material for semiconductor packaging by 248 nm excimer laser", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730E (5 March 2021); https://doi.org/10.1117/12.2578038

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KEYWORDS

Glasses

Semiconductors

Excimer lasers

Packaging

Semiconductor materials

Semiconducting wafers

Laser drilling

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