We describe our R & D on optoelectronic packaging technologies such as the optical backplane utilizing 300 pieces of
the high index contrast fine multimode fibers and the low-cost and high-density OE-conversion parallel link modules
operating at 10 Gbps /ch for less than 1 m regime applications. Combination of the developed backplane and the
modules implies potential of 3 Tbps aggregate throughputs at the board-to-board level optical interconnections. We also
introduce novel component technologies for low-cost and high-density optical coupling between optical devices. These
technologies include the monolithic two wavelengths twin VCSELs and easy self-alignment coupling technology
capable of alleviating difficulties for optics penetration inside the box.
Conference Committee Involvement (2)
Optoelectronic Interconnects and Component Integration XI
24 January 2011 | San Francisco, California, United States
Optoelectronic Interconnects and Component Integration X
25 January 2010 | San Francisco, California, United States
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