Dr. Soon Aik Chew
at imec
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 10 April 2024 Poster
Proceedings Volume 12955, 129552T (2024) https://doi.org/10.1117/12.3010482
KEYWORDS: Metrology, Semiconducting wafers, Copper, Chemical mechanical planarization, Surface roughness, High volume manufacturing, Atomic force microscopy, Wafer bonding, Wafer testing, System integration

Proceedings Article | 10 April 2024 Presentation + Paper
Proceedings Volume 12955, 129551N (2024) https://doi.org/10.1117/12.3008658
KEYWORDS: Copper, Semiconducting wafers, Scanning electron microscopy, Wafer bonding, Sensors, Atomic force microscopy, Signal detection, Image sensors, Chemical mechanical planarization, Target detection

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