Rare-earth ion defects in solid-state hosts have emerged as a promising candidate for emissive quantum memories owing to their inherent spin–photon interface and long optical and spin coherence times. Erbium (Er3+) in particular has optical transitions in the C-band making it well suited to the use of existing telecom technology infrastructure. In this work, we present a platform to integrate rare-earth ions into standard silicon photonic circuits. Erbium is co-deposited in CMOS-compatible TiO2 host films onto SOI and patterned into high Purcell factor photonic crystal cavities. Purcell factors in excess of 500 are observed and transient spectral hole burning and photoluminescence excitation scans reveal homogeneous linewidths below 15 MHz. Additionally, we show that photonic wirebonding can provide a solution for low-loss and thermally stable fiber-to-chip coupling.
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