This paper proposes a practical micro-object operation based on the dynamic analysis considering the adhesive effect under a scanning electron microscope (SEM). Recently, techniques of arranging micrometer-sized objects with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Since adhesion is dominant compared to gravity in the micro world, manipulation techniques using a needle-shaped tool by adhesive force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these have been used just for the empirical reasons. Some even need the process of trial-and-error. Therefore, we analyze micro-object operation theoretically by introducing new physical factors, such as adhesive force and rolling-resistance, into the dynamic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, we reveal that it is possible to fracture the contact interfaces selectively by controlling tool-loading angle reasonably. Based on the acquired knowledge, we also proposed the practical method of the pick and place operation of a micro-sphere under an SEM.
There is a great demand for arrangement of micro objects smaller than 100 micrometers with high accuracy and reliability in order to construct micro devices. Since micro objects tend to adhere to other objects by electrostatic force, we can pick them up easily by contacting with a needle tip instead of grasping by tweezers. On the contrary, it is difficult to place them on a substrate. To solve this problem, we have proposed a handling method by controlling the facing area, i.e. picking up the object by contacting with the center of the tooltip plane, and placing it by contacting with the edge and also inclining the tool. However it is difficult to execute this operation by manual control, because it requires delicate control of the manipulator, not to break or flip away the object. In this study, we automate this pick-and-place operation by visual and force control. Moreover, to arrange micro objects with high accuracy and reliability, all necessary functions such as calibration, object search, and positioning are integrated, and an automatic handling system is constructed. We successfully demonstrate a completely automatic arrangement of several micro objects of 30 micrometers in diameter under SEM monitoring.
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