Dr. Sergiu Langa Profile

Dr. Sergiu Langa

at Fraunhofer IPMS

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Author

Publications (5)

Proceedings Article | 2 March 2022 Presentation + Paper

Squeeze film damping in MEMS loudspeakers: analysis of a clamped-clamped microbeam

Anton Melnikov, Hermann A. G. Schenk, Franziska Wall, Jorge M. Monsalve, Lutz Ehrig, Michael Stolz, Andreas Mrosk, Sergiu Langa, Bert Kaiser

Proceedings Volume 11955, 1195504 (2022) https://doi.org/10.1117/12.2616657

KEYWORDS: Finite element methods, 3D modeling, Microelectromechanical systems, Fluid dynamics, Electrodes, Acoustics, Transducers, Physics, Modeling, Microfluidics

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Proceedings Article | 28 February 2020 Paper

Minimization of nonlinearities in nano electrostatic drive actuators using validated coupled-field simulation

Anton Melnikov, Hermann A. G. Schenk, Franziska Wall, Barbara Spitz, Lutz Ehrig, Sergiu Langa, Michael Stolz, Bert Kaiser, Holger Conrad, Harald Schenk

Proceedings Volume 11293, 112930D (2020) https://doi.org/10.1117/12.2551271

KEYWORDS: Actuators, Finite element methods, Silicon, Microelectromechanical systems, Solids, Capacitors, Differential equations, Complex systems, Acoustics

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Proceedings Article | 21 March 2018 Presentation + Paper

Translatory MEMS actuator with wafer level vacuum package for miniaturized NIR Fourier transform spectrometers

Thilo Sandner, Eric Gaumont, Thomas Grasshoff, Gerald Auböck, Andreas Kenda, Thomas Gisler, Sergiu Langa, Andreas Herrmann, Jan Grahmann

Proceedings Volume 10545, 105450W (2018) https://doi.org/10.1117/12.2290588

KEYWORDS: Mirrors, Semiconducting wafers, Glasses, Protactinium

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Proceedings Article | 20 February 2017 Presentation + Paper

A contribution to the expansion of the applicability of electrostatic forces in micro transducers

Harald Schenk, Holger Conrad, Matthieu Gaudet, Sebastian Uhlig, Bert Kaiser, Sergiu Langa, Michael Stolz, Klaus Schimmanz

Proceedings Volume 10116, 1011603 (2017) https://doi.org/10.1117/12.2249575

KEYWORDS: Actuators, Transducers, Microelectromechanical systems, Electrodes, Semiconducting wafers, Surface micromachining, Field emission displays, Silicon, Etching, Aluminum

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Proceedings Article | 9 March 2013 Paper

Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

S. Langa, C. Drabe, C. Kunath, A. Dreyhaupt, H. Schenk

Proceedings Volume 8614, 86140F (2013) https://doi.org/10.1117/12.2003525

KEYWORDS: Semiconducting wafers, Glasses, Micromirrors, Wafer bonding, Packaging, Interfaces, Silicon, Actuators, Laser bonding, Microelectromechanical systems

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