Polymer powder bed additive manufacturing is the most prolific industrial additive manufacturing technology, thanks to Laser Sintering and High Speed Sintering (HSS) technologies. Recent advancements have included adding additional laser systems (with significant costs) and the use of HSS technologies to increase machine throughput. However, polymer powder bed AM technologies are still very limited on processable materials and quality control. Ascend Manufacturing is leveraging high power digital micromirror devices (DMD) to overcome these obstacles and provide a commercial next-generation additive manufacturing solution. This presentation will introduce Ascend Manufacturing's novel Large Area Projection Sintering technology and discuss the additional advantages of area-based processing.
Self Assembly is a promising alternative to conventional pick and place robotic assembly of micro components. Its
benefits include parallel integration of parts with low equipment costs. Various approaches to self assembly have been
demonstrated, yet demanding applications like assembly of micro-optical devices require increased positioning
accuracy. This paper proposes a new method for design of self assembly bonds that addresses this need. Current
methods have zero force at the desired assembly position and low stiffness. This allows small disturbance forces to
create significant positioning errors. The proposed method uses a substrate assembly feature to provide a high accuracy
alignment guide to the part. The capillary bond region of the part and substrate are then modified to create a non-zero
positioning force to maintain the part in the desired assembly position. Capillary force models show that this force
aligns the part to the substrate assembly feature and reduces sensitivity of part position to process variation. Thus, the
new configuration can substantially improve positioning accuracy of capillary self-assembly. This will result in a
dramatic decrease in positioning errors in the micro parts. Various binding site designs are analyzed and guidelines are
proposed for the design of an effective assembly bond using this new approach.
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