Mr. Marc Bouchardy Profile

Marc Bouchardy

Masks Process Engineer at X-FAB France SAS

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 15 March 2006 Paper

Evaluation of an advanced process control solution to detect wafer positioning issues within the hot and cold plate modules of a lithography track

Olivier Guillaume, Marc Bouchardy, Louis-Pierre Armellin

Proceedings Volume 6155, 61550K (2006) https://doi.org/10.1117/12.655573

KEYWORDS: Semiconducting wafers, Temperature metrology, Process control, Chemical elements, Lithography, Wafer testing, Robotics, Sensors, Data communications, Critical dimension metrology

Read Abstract +

To run the various steps of the process, multiple robot arm transfers within the Hot and Cold Plate modules which directly influence the critical dimension of the production wafers were performed on the lithography track. Wafer positioning inside these modules was found to be one of the key parameters to obtain the best critical dimensional uniformity across the wafer. With the currently realized track monitoring and conventional Statistical Process Control (SPC), potential process drifts or errors within these modules can only be detected from wafers measured during the post process control of product parameters. To catch all potential non-conformal production wafers directly at the tool, minimize equipment downtime and identify the root cause of maintenance issues, the real-time control of tool and process parameters is required. This paper presents the results of the evaluation of an Advanced Process Control (APC) solution used to detect in real-time mode any wafer positioning issues within the Hot and Cold Plate modules of a lithography track based on the monitoring of the plate temperature profile during wafer processing. After an explanation of the methodology used to collect the data from the tool, an initial phase of analysis of the temperature profile of the different Hot Plate modules was carried out. The monitoring of the temperature range was identified as the key parameter for the detection of wafer positioning issues where the temperature profile depends on the number of resistive heating elements, temperature settings and process conditions of the Hot Plate. The wafer tilt was simulated to compare the temperature profile to standard process conditions and in turn determine the detection capability. For the Cold Plate module, it was necessary to know the time between the end of the hot step and the start of the following cold step in order to detect a real tilt issue.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years