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Konstantinos Stamoulis
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Publications (1)
Proceedings Article | 22 January 2005 Paper
Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds
Konstantinos Stamoulis, Christine Tsau, S. Mark Spearing
Proceedings Volume 5716, (2005) https://doi.org/10.1117/12.590976
KEYWORDS: Gold, Semiconducting wafers, Wafer bonding, Silicon, Interfaces, Surface roughness, Temperature metrology, Packaging, Thin films, Digital signal processing
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