In order to address new technology requirements, Spray Photoresist Dispense Processing has been developed to aid in the manufacturing of High Aspect Ratio devices. The choice of process pump to affect the Spray Process is critical to the results, as the dispense uniformity is greatly influenced by the type of pump used to supply fluid to the Ultra Sonic dispense nozzle. Previous methods used had insufficient ramp rate of the dispense output. The pressure on demand dispense unit has excellent ramp rate to required flow rate, and the Patented Control Technology provides stability within tolerance to improve overall uniformity. The implementation of this method will improve cycle time and reduce the processing cost of wafers.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.