Recent improvements in photovoltaic cell technologies have increased efficiency and decreased size to the point that
they are much more attractive for use in optically powered and isolated electronics. Applications can include powering a
small group of components for simple sensors to much more complex systems which incorporate high speed digital
communication between remote locations. Although optical to electrical conversion efficiencies are approaching 50%,
the remaining power is still lost as heat. Heat becomes a compound problem because too much can cause photocell
efficiency to decrease producing more heat and eventually leading to thermal runaway and breakdown. Thermal
management is the key to balancing the maximum amount of input power while minimizing the effect of heat on the
efficiency. This paper describes an effort currently under way to develop packaging which combines passive alignment
techniques with changes to photocell architecture specifically designed to improve thermal management.
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