HgCdTe has been the material of choice for MWIR, and LWIR infrared sensing due to its highly tunable band gap and favorable material properties. However, HgCdTe growth and processing for the ESWIR spectral region is less developed, so alternative materials are actively researched. It is important to compare the fundamental limitations of each material to determine which offers optimal device performance. In this article, we investigate the intrinsic recombination mechanisms of ESWIR materials—InGaAs, GeSn, and HgCdTe—with cutoff wavelength near 2.5μm, and MWIR with cutoff of 5μm. First, using an empirical pseudo-potential model, we calculate the full band structure of each alloy using the virtual crystal approximation, modified to include disorder effects and spin-orbit coupling. We then evaluate the Auger and radiative recombination rates using a Green’s function based model, applied to the full material band structure, yielding intrinsic carrier lifetimes for each given temperature, carrier injection, doping density, and cutoff wavelength. For example, we show that ESWIR HgCdTe has longer carrier lifetimes than InGaAs when strained or relaxed near room temperature, which is advantageous for high operating temperature photodetectors. We perform similar analyses for varying composition GeSn by comparing the calculated lifetimes with InGaAs and HgCdTe. Finally, we compare HgCdTe, InAsSb and GeSn with a cutoff in the MWIR spectral band.
Indium gallium arsenide (In1−xGaxAs) is an ideal material choice for short wave infrared (SWIR) imaging due to its low dark current and excellent collection efficiency. By increasing the indium composition from 53% to 83%, it is possible to decrease the energy gap from 0.74 eV to 0.47 eV and consequently increase the cutoff wavelength from 1.7 μm to 2.63 μm for extended short wavelength (ESWIR) sensing. In this work, we apply our well-established numerical modeling methodology to the ESWIR InGaAs system to determine the intrinsic performance of pixel detectors. Furthermore, we investigate the effects of different buffer/cap materials. To accomplish this, we have developed composition-dependent models for In1−xGaxAs, In1−xAlxAs, and InAs1−y Py. Using a Green’s function formalism, we calculate the intrinsic recombination coefficients (Auger, radiative) to model the diffusion-limited behavior of the absorbing layer under ideal conditions. Our simulations indicate that, for a given total thickness of the buffer and absorbing layer, structures utilizing a linearly graded small-gap InGaAs buffer will produce two orders of magnitude more dark current than those with a wide gap, such as InAlAs or InAsP. Furthermore, when compared with experimental results for ESWIR photodiodes and arrays, we estimate that there is still a 1.5x magnitude of reduction in dark current before reaching diffusion-limited behavior.
Understanding the radiative and non-radiative properties of semiconductor materials is a prerequisite for optimizing the performance of existing light emitters and detectors and for developing new device architectures based on novel materials. Due to the ever increasing complexity of novel semiconductor systems and their relative technological immaturity, it is essential to have design tools and simulation strategies that include the details of the microscopic physics and their dependence on the macroscopic (continuum) variables in the macroscopic device models. Towards this end, we have developed a robust full-band structure based approach that can be used to study the intrinsic material radiative and non-radiative properties and evaluate the same characteristics of low-dimensional device structures. A parallel effort is being carried out to model the effect of substrate driven stress/strain and material quality (dislocations and defects) on microscopic quantities such as non-radiative recombination rate. Using this modeling approach, we have extensively studied the radiative and non-radiative properties of both elemental (Si and Ge) and compound semiconductors (HgCdTe, InGaAs, InAsSb and InGaN). In this work we outline the details of the modelling approach, specifically the challenges and advantages related to the use of the full-band description of the material electronic structure. We will present a detailed comparison of the radiative and Auger recombination rates as a function of temperature and doping for HgCdTe and InAsSb that are two important materials for infrared detectors and emitters. Furthermore we will discuss the role of non-radiatiave Auger recombination processes in explaining the performance of light emitter diodes. Finally we will present the extension of the model to low dimensional structures employed in a number of light emitter and detector structures.
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