In double patterning lithography (DPL) layout decomposition for 45nm and below process nodes, two features
must be assigned opposite colors (corresponding to different exposures) if their spacing is less than the minimum
coloring spacing.5, 11, 14 However, there exist pattern configurations for which pattern features separated by
less than the minimum coloring spacing cannot be assigned different colors. In such cases, DPL requires that
a layout feature be split into two parts. We address this problem using a layout decomposition algorithm that
incorporates integer linear programming (ILP), phase conflict detection (PCD), and node-deletion bipartization
(NDB) methods. We evaluate our approach on both real-world and artificially generated testcases in 45nm
technology. Experimental results show that our proposed layout decomposition method effectively decomposes
given layouts to satisfy the key goals of minimized line-ends and maximized overlap margin. There are no design
rule violations in the final decomposed layout. While we have previously reported other facets of our research
on DPL pattern decomposition,6 the present paper differs from that work in the following key respects: (1)
instead of detecting conflict cycles and splitting nodes in conflict cycles to achieve graph bipartization,6 we split
all nodes of the conflict graph at all feasible dividing points and then formulate a problem of bipartization by
ILP, PCD8 and NDB9 methods; and (2) instead of reporting unresolvable conflict cycles, we report the number
of deleted conflict edges to more accurately capture the needed design changes in the experimental results.
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