This paper describes frequency vibration sensors for signature analysis on (electro)mechanical components. The application is predictive diagnostics and condition based maintenance on Xerographic printer and copier products. The vibration signature analysis (VSA) sensing devices consist of micromachined arrays of closely spaced silicon mechanical resonators covering a frequency range of 120 Hz to 100 kHz. Resonance of a particular element is detected with a Wheatstone bridge of implanted piezoresistors and the bridge outputs are multiplexed onto a common output line using on- chip p-MOS transistor switches. The design and fabrication of the VSA devices is presented.
This paper presents the design, modeling, and verification of a MEMS silicon torsion mirror for applications in laser printing. It begins with a description of the torsion mirror design, followed by detailed discussions of modeling and verification of the design. A coupled electro-mechanical computer-aided-design software package MEMCAD is used to perform both electrical and mechanical analysis of the mirror under different applied voltages. The MEMCAD modeling results are then post-processed through a program, which retrieves the displacement components of nodes from MEMCAD output and fits a quadratic surface to the deformed reflecting mirror surface. This approximated surface is to be used later in an optical modeling package to analyze the optical performance of the device. The post-processed results are verified by experiential measurements. The first six natural modes of the mirror are determined and are given to help understand the mechanical response of the mirror to different excitation frequencies, Finally, with the aid of MEMCAD, sensitivity analysis for translation versus rotation is performed in order to optimize the mirror design for a raster output scanner (ROS) optical system.
The generic design and operating principles of acceleration sensors are reviewed in terms of three partial transfer functions. An accelerometer's mechanical transfer function describes the conversion of an applied acceleration input into mechanical stress and strain in structural elements. Its electromechanical transfer function describes transduction of these elementary quantities of the mechanical energy domain into elementary quantities of the electrical domain. The electrical transfer function describes conversion of the elementary electrical quantities into an electrical output signal. The generic design issues and principles are highlighted for each of the partial transfer functions, within the boundary conditions of silicon implementations and against the widely varying background of diverse application areas. The case study of a bulk micromachined uniaxial capacitive micro-accelerometer illustrates a reduction to practice and demonstrates how accelerometer performance specifications are translated into silicon, based on the generic design principles.
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