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Dimitris Reppas
at Prisma Electronics SA
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 10 March 2021 Presentation + Paper
Laser induced forward transfer of solder paste for microelectronics assembly applications
Proceedings Volume 11673, 116730X (2021) https://doi.org/10.1117/12.2577693
KEYWORDS: Laser welding, Microelectronics, Laser applications, Printing, Receivers, Nanoparticles, Metals, Imaging systems, High speed cameras
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