The partnership between RVS, Seek Thermal and Freescale Semiconductor continues on the path to bring the latest technology and innovation to both military and commercial customers. The partnership has matured the 17μm pixel for volume production on the Thermal Weapon Sight (TWS) program in efforts to bring advanced production capability to produce a low cost, high performance product. The partnership has developed the 12μm pixel and has demonstrated performance across a family of detector sizes ranging from formats as small as 206 x 156 to full high definition formats. Detector pixel sensitivities have been achieved using the RVS double level advanced pixel structure. Transition of the packaging of microbolometers from a traditional die level package to a wafer level package (WLP) in a high volume commercial environment is complete. Innovations in wafer fabrication techniques have been incorporated into this product line to assist in the high yield required for volume production. The WLP seal yield is currently > 95%. Simulated package vacuum lives >> 20 years have been demonstrated through accelerated life testing where the package has been shown to have no degradation after 2,500 hours at 150°C. Additionally the rugged assembly has shown no degradation after mechanical shock and vibration and thermal shock testing. The transition to production effort was successfully completed in 2014 and the WLP design has been integrated into multiple new production products including the TWS and the innovative Seek Thermal commercial product that interfaces directly to an iPhone or android device.
Polarimetry sensor development has been in work for some time to determine the best use of polarimetry to differentiate
between manmade objects and objects made by nature. Both MWIR and LWIR and 2-color staring Focal Plane Arrays
(FPAs) and LWIR scanning FPAs have been built at Raytheon Vision Systems each with exceedingly higher
performance. This paper presents polarimetric performance comparisons between staring 2562 MWIR, 2562 LWIR, 5122
LWIR/LWIR staring FPAs and scanning LWIR FPAs.
LWIR polarimetry has the largest polarimetric signal level and a larger emissive polarimetric signature than MWIR
which makes LWIR less dependent on sun angles. Polished angled glass and metal objects are easily detected using
LWIR polarimetry.
While single band 9-11 um LWIR polarimetry has advantages adding another band between 3 and 7 um improves the
capability of the sensor for polarization and spectral phenomenology. In addition the 3-7 um band has improved NEDT
over the 9-11 um band due to the shorter detector cutoff reducing the Noise Equivalent Degree of Linear Polarization.
(NEDOLP).
To gain acceptance polarimetric sensors must provide intelligence signatures that are better than existing nonpolarimetric
Infrared sensors. This paper shows analysis indicating the importance of NEDOLP and Extinction ratios.
Raytheon has developed a 3rd-Generation FLIR Sensor Engine (3GFSE) for advanced U.S. Army systems. The sensor
engine is based around a compact, productized detector-dewar assembly incorporating a 640 x 480 staring dual-band
(MW/LWIR) focal plane array (FPA) and a dual-aperture coldshield mechanism. The capability to switch the
coldshield aperture and operate at either of two widely-varying f/#s will enable future multi-mode tactical systems to
more fully exploit the many operational advantages offered by dual-band FPAs. RVS has previously demonstrated high-performance
dual-band MW/LWIR FPAs in 640 x 480 and 1280 x 720 formats with 20 μm pitch. The 3GFSE includes
compact electronics that operate the dual-band FPA and variable-aperture mechanism, and perform 14-bit analog-to-digital
conversion of the FPA output video. Digital signal processing electronics perform "fixed" two-point non-uniformity
correction (NUC) of the video from both bands and optional dynamic scene-based NUC; advanced
enhancement processing of the output video is also supported. The dewar-electronics assembly measures approximately
4.75 x 2.25 x 1.75 inches. A compact, high-performance linear cooler and cooler electronics module provide the
necessary FPA cooling over a military environmental temperature range. 3GFSE units are currently being assembled
and integrated at RVS, with the first units planned for delivery to the US Army.
RVS has made a significant breakthrough in the development of a 640 × 512 array with a unit cell size of
20μm × 20 μm and performance equivalent to that of the 25μm arrays. The successful development of this array is the
first step in achieving mega-pixel formats. This FPA is designed to ultimately achieve performance near the
temperature fluctuation limited NETD (<20mK, f/1, 30 Hz). The SB-300 is a highly productized readout and is
designed to achieve very good sensitivity (low NETD and low spatial noise) and good dynamic range. The improved
performance is through bolometer structure improvements and an innovative ROIC design. It also has a simple and
flexible electrical interface which allows external electronics to be small, light, low-cost, and low-power. Almost all
adjustments can be made through the serial interface; hence there is no need for external adjustable (DAC) circuitry.
The improved power supply rejection helps maintain highly stable detector and strip resistor bias voltages which helps
reduce spatial noise and image artifacts.
We will show updated performance and imagery on these arrays, which is currently being measured at <30mK, f/1,555
30 Hz. Pixel operability is greater than 99.5% on most FPAs, where the uncorrected responsivity nonuniformity is less
than 4% (sigma/mean), and time constant for these arrays was measured at <8msec. We will report detailed FPA
performance results including responsivity, noise, uniformity and pixel operability. We also plan to present video
imagery from the most recent FPAs. The reduction in pixel size offers several potential benefits for IR systems. For a
given system resolution (IFOV) requirement, the 20 μm pixel will allow an optical volume that is 50 % the size of a 25
μm based system!
We will also provide an update on the enhanced performance and yield producibility of our NVESD ManTech
640 × 480 25 μm arrays, and also show data on 25 μm arrays that have been designed for faster time constants (5 ms),
while maintaining high performance.
We will also show the improvement in our uncooled 320 × 240 and 640 × 480 sensor electronics in terms of reduced
power and size for helmet and rifle mounted sensors.
D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, T. Sessler, S. Baur, D. Van Lue, S. Anderson, R. Chin, H. Gonzalez, C. Le Pere, S. Ton, T. Kostrzewa
RVS is producing high-quality microbolometer FPAs with 25 μm pixels. We have developed formats in both 320 x 240 and 640 x 480 array formats. These FPAs have demonstrated sensitivities that are comparable to microbolometer FPAs with 50 μm pixels with the best measured NETD value for these FPAs now <25mK with an f/1 aperture and operating at 30 Hz frame rates. Pixel operability is greater than 99.9% on most FPAs, and uncorrected responsivity nonuniformity is less than 3% (sigma/mean). These 25 μm microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. These arrays have produced excellent image quality, and are currently fielded in a variety of systems. We will report on our latest performance data and IR captive flight test imagery. We will also show data on 25μm arrays that have been designed for faster time constants (5 msec), while maintaining high performance. RVS is also developing a 320 x 240 50μm mid-wave responding FPA. We will review the MWIR sensitivity improvements with this array and provide IR imagery. RVS is developing a 640 x 480 25μm uncooled FPA for a countermine detection application using a two-band assembly designed to be sensitive in both the Restrahlen and Thermal spectral bands. We will provide IR image data on these arrays. RVS has made a significant breakthrough in the development of a 640 x 512 array with a unit cell size of 20 μm x 20 μm, and performance approaching that of the 25μm arrays. The successful development of this array is the first step in achieving mega-pixel formats. This FPA is designed to ultimately achieve performance near the temperature fluxuation limited NETD (<20mK, f/1, 30 Hz). We will show updated performance and imagery on these arrays, which is currently being measured at <45mK, f/1, 30 Hz.
Raytheon is producing high-quality 320 x 240 microbolometer FPAs with 25 μm pitch pixels. The 320 x 240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 μm pixels. Typical NETD values for these FPAs are <50mK with an f/1 aperture and operating at 30 Hz frame rates. Pixel operability is greater than 99.9% on most FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). These 25 μm microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. These arrays have produced excellent image quality, and are currently fielded in a variety of demonstration systems. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased, and also has enabled the development of a large-format 640 x 480 FPA array. Raytheon is producing these arrays with excellent sensitivity and typical NETD values of <50mK with an f/1 aperture and operating at 30 Hz frame rates. These arrays have excellent operability and image quality. Several dual FOV prototype 640 x 480 systems have been delivered under the LCMS and UAV programs. RVS has developed a flexible uncooled front end (UFE) electronics that will serve as the basis for the camera engine systems using 320 x 240 arrays. RVS has developed a 640 x 480 Common Uncooled Engine (CUE) which is intended for small pixel, high performance applications. The CUE is the ideal cornerstone for ground and airborne systems, multi-mode sensor, weapon sight or seeker architectures, and commercial surveillance.
The Low Cost Microsensors (LCMS) Program recently demonstrated state-of-the-art imagery in a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 x 480 format focal plane array (FPA) engine. The 640 x 480 sensor is applicable to long-range surveillance and targeting missions. The intent of this DUS&T effort was to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging. In addition, the Advanced Uncooled Thermal Imaging Sensors (AUTIS) Program extended this development to light-weight, compact unmanned aerial vehicle (UAV) applications.
Daniel Murphy, Adam Kennedy, Michael Ray, Richard Wyles, Jessica Wyles, James Asbrock, C. Hewitt, David Van Lue, T. Sessler, John Anderson, Daryl Bradley, Richard Chin, H. Gonzales, C. Le Pere, Thomas Kostrzewa
Raytheon Vision Systems (RVS) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon is producing high-quality 320 x 240 microbolometer FPAs with 25 μm pitch pixels. The 320 x 240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 μm pixels. The array average NETD value for these FPAs is about 30 mK with an f/1 aperture and operating at 30 Hz frame rates. Pixel operability is greater than 99% on most FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). These 25 μm microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micro machining fabrication process, which allows maximization of both the thermal isolation and the optical fill-factor. These arrays have produced excellent image quality, and are currently fielded in demonstration systems. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 μm pxiels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. These FPAs are applicable to wide-field-of-view, long-range surveillance and targeting missions. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased, and also has enabled the development of a large-format 640 x 480 FPA array. Raytheon is producing these arrays with very good sensitivity. These arrays have excellent operability and image quality. Several dual FOV prototype systems have been delivered under the LCMS and UAV programs, and are under evaluation at NVESD. Raytheon Vision Systems (RVS) has developed a flexible uncooled front end (UFE) electronics that will serve as the basis for camera engine systems using 320 x 240 and 640 x 480 FPAs. The focus has been to develop architecture suitable for a wide variety of systems from low cost modest performance to high performance military applications. This product has been designed with military environmental and shock and vibration conditions in mind. Intended for small pxiel, high performance applications, the UFE is the ideal cornerstone for ground and airborne UAV, multi-mode sneosr, weapon sight or seeker architectures.
Daniel Murphy, Michael Ray, Richard Wyles, James Asbrock, Nancy Lum, Jessica Wyles, C. Hewitt, Adam Kennedy, David Van Lue, John Anderson, Daryl Bradley, Richard Chin, Thomas Kostrzewa
Raytheon IR Operations (RIO) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced the first high-quality 320×240 microbolometer FPAs wiht 25μm pitch pixels. The 320×240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50μm pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and oepratin at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99 percent on some FPAs, and uncorrected responsivity nonconformity is less than 4%. The microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been acheived as a result of an advanced micromachining fabrication process. The process allwos maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution requirement, the 25 μm pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640×480 FPA array. Raytheon has produced arrays with very good sensitivity, operability, and excellent image quality. These FPAs are applicable to wide-field-of-view, long range surveillance and targeting missions. Raytheon is also developing a high performance 160×128 FPA that is designed for applications where miniaturizaitno and temperature invariance are required as well as low cost and low power.
Daniel Murphy, Michael Ray, Richard Wyles, James Asbrock, Nancy Lum, Jessica Wyles, C. Hewitt, Adam Kennedy, David Van Lue, John Anderson, Daryl Bradley, Richard Chin, Thomas Kostrzewa
Raytheon Infrared Operations (RIO) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced the first high-quality 320x240 microbolometer FPAs with 25 micrometers pitch pixels. The 320 x240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 micrometers pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and operating at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99% on some FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). The microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micromachining fabrication process. The process allows maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 micrometers pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640x480 FPA array. Raytheon has produced arrays with very good sensitivity, operability, and excellent image quality. These FPAs are applicable to wide-field-of-view, long range surveillance and targeting missions. Raytheon is also developing a high performance 160x128 FPA that is designed for applications where miniaturization and temperature invariance are required as well as low cost and low power.
The Low Cost Microsensors (LCMS) Program recently demonstrated state-of-the-art imagery in a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 X 480 format focal plane array (FPA) engine. The 640 X 480 sensor is applicable to long-range surveillance and targeting missions. The intent of this DUS&T effort is to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging.
Daniel Murphy, Michael Ray, Richard Wyles, James Asbrock, Nancy Lum, Adam Kennedy, Jessica Wyles, C. Hewitt, Glen Graham, Tad Horikiri, John Anderson, Daryl Bradley, Richard Chin, Thomas Kostrzewa
RIO has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced high-quality 320 by 240 micro bolometer FPAs with 25 micrometers pitch pixels. The 320 by 240 FPAs have a sensitivity that is comparable to micro bolometer FPAs with 50 micrometers pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and operating at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99 percent on some FPAs, and uncorrected responsivity nonuniformity is less than 4 percent. The micro bolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micromachining fabrication process. The process allows maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution requirement, the 225 micrometers pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640 by 512 FPA array applicable to wide-field-of-view, long range surveillance and targeting missions, and a 160 by 128 array where applications for miniaturization and temperature invariance are required as well as low cost and low power.
The objectives of the Integrated Imaging Sensors (I2S) Program are rtwofold. The first is to develop and deliver a rifle sight containing a single aperture and optical path for receiving, combining, and viewing radiation from the separate infrared (IR) and visible bands in a single image simultaneously. The second is to develop a sensor array sensitive in the radiation band spanning approximately from 0.4 μm to 1.7 μm by "fusing" indium-gallium-arsenic material onto silicon charge coupled devices. The ability to coincidentally and simultaneously form images from these two separate radiation bands is expected to significantly improve the detection and identification of objects from the case where only one radiation band is employed. Additionally, extending the cutoff of the visible band from 0.9 μm to 1.7 μm is expected to enhance viewing in this band as there is more available light, and further lessons the exacting requirement of desigining nearly noise free detectors.
The objectives of the Low Cost Microsensors (LCMS) Program are twofold. The first is to develop and deliver a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 X 512 format focal plane array (FPA) engine. The second is to develop an expendable microsensor built upon a VOx 160 X 128 format FPA engine. The 640 X 480 sensor is applicable to long-range surveillance and targeting missions and is a reusable asset. The 160 X 120 sensor is designed for applications where miniaturization is required as well as low cost and low power. The 160 X 120 is also intended for expendable military applications. The intent of this DUS&T effort is to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging.
Raytheon Infrared Operations (RIO) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced high-quality 320 X 240 microbolometer FPAs with 25 μm pitch pixels. The 320 X 240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 micrometers pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and operating at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99% on some FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). The microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micromachining fabrication process. The process allows maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 μm pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640 X 512 FPA array applicable to wide-field-of-view, long range surveillance and targeting missions, and a 160 X 128 array where applications for miniaturization and temperature invariance are required as well as low cost and low power.
The objectives of the Low Cost Microsensors Program are twofold. The first is to develop and deliver a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 X 480 format focal plane array (FPA) engine. The second is to develop an expendable microsensor built upon a VOx 160 X 120 format FPA engine. The 640 X 480 sensor is applicable to long-range surveillance and targeting missions and is a reusable asset. The 160 X 120 sensor is designed for applications where miniaturization is required as well as low cost and low power. The 160 X 120 is also intended for expendable military applications. The intent of this DUS&T effort is to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging.
William Radford, Daniel Murphy, James Finch, Kathy Hay, Adam Kennedy, Michael Ray, Aladin Sayed, Jessica Wyles, Richard Wyles, John Varesi, Edgar Moody, F. Cheung
Raytheon IRCOE has developed a family of uncooled, microbolometer FPAs. These FPAs have been designed to address commercial and high-performance military applications. The SB-151 is a high-sensitivity 320 X 240 FPA with 50 micrometers pixels. The SB-151 FPA has been fabricated with several microbolometer pixel designs that allow optimization of either sensitivity or response time. Noise equivalent temperature difference (NETD) values as low as 8.6 mK have been measured for the SB-151 FPAs with f/1 optics. NETD values less than 25 mK have been measured for FPAs with thermal time constants of approximately 18 msec.
Raytheon Systems Company has developed a prototype infrared imaging rifle-sight using an uncooled, microbolometer FPA. The high-sensitivity FPA (SBRC-151) used in the Long-wavelength Staring Sensor (LWSS) was developed by Raytheon Infrared Center of Excellence (IR COE). The NETD (noise equivalent temperature difference) sensitivity of the camera has been measured at 14 mK with f/1 optics and at 74 mK with an f/2.1 aperture stop. Excellent imagery has been demonstrated with the f/2.1 aperture. The 320 X 240 FPA utilizes a high-yield CMOS readout integrated circuit (ROIC) that achieves high sensitivity, low output nonuniformity, and large scene dynamic range. The ROIC provides multi-level, on-chip nonuniformity correction and on-chip temperature compensation. The FPA has 50 micrometer X 50 micrometer pixels and operates at frame rates up to 60 Hz with a single output. The LWSS was characterized by the U.S. Army's NVESD in 1997 using an earlier version of the SBRC-151 FPA. The NVESD measurements validated the Raytheon NETD data. The NVESD evaluation also demonstrated outstanding MRT and spatial noise characteristics. The VOx microbolometer detectors are produced at the Raytheon IR COE facility in Santa Barbara, CA using an advanced dry-etch fabrication process. In addition to the LWSS project, the IR COE has initiated production of the microbolometer FPAs (AE-189) for commercial applications. Over 600 FPAs have been produced on this project, and data is presented for the first 250 FPAs that have been packaged and tested. The pixel operability of the production radiometer FPAs (AE-189) is typically greater than 99.9%.
Raytheon Sensors and Communications Systems has developed a prototype infrared imaging rifle-sight using an uncooled, microbolometer FPA. The Longwavelength Staring Sensor (LWSS) has been characterized by NVESD, where it demonstrated NETD and MRT values that are unsurpassed for uncooled FPA technology. The NVESD-measured NETD values were 24 mK with f/0.7 optics and 42 mK with an f/1/0 aperture. When used with the f/0.7 optics, NVESD measured MRT values less than 60 mK at the nyquist spatial frequency. Similar measurements at f/1.0 produced MRT values less than 110 mK. Further optimization of the microbolometers is expected to produce FPAs with NETD values less than 20 mK for f/1.0 apertures. The high- performance uncooled microbolometer FPA (SBRC-151) used in the LWSS was developed by Raytheon Santa Barbara Research Center. The 320 X 240 FPA utilizes a high-yield CMOS readout integrated circuit (ROIC) that achieves high sensitivity, low output nonuniformity, and large scene dynamic range. The ROIC provides multi-level, on-chip nonuniformity correction and on- chip temperature compensation. The FPA has 50 micrometer X 50 micrometer pixels and operates at frame rates up to 60 Hz with a single output. The VOX microbolometer detectors are produced at SBRC using an advanced dry-etch fabrication process. In addition to the LWSS project, SBRC has initiated low-rate production of the microbolometer FPAs. This work is being performed in support of Raytheon-Amber for commercial radiometer cameras. The pixel operability of the production radiometer FPAs (AE-189) are greater than 99.9%.
SBRC has developed a high-quality 320 X 240 room- temperature infrared FPA that operates in the 8 - 14 micrometers spectral band. The FPA is based upon the silicon microbolometer technology that has been licensed from Honeywell. This monolithic uncooled FPA utilizes a novel BiCMOS readout circuit that provides high sensitivity and excellent output uniformity. The 320 X 240 FPA operates at frame rates up to 60 Hz with a single output. The microbolometers were fabricated monolithically on the silicon readout circuits at SBRC using VOx as the bolometer material. As advanced microbridge structure design was used that achieves an optical fill-factor greater than 65% in the 48 micrometers X 48 micrometers pixels. The structure also provides excellent thermal isolation for high responsivity and sensitivity. Initial measurements indicate the FPAs are operating with an NETD sensitivity of about 100 mK for an f/1 aperture. This FPA is ultimately expected to operate at sensitivities of less than 20 mK. The FPA also demonstrates peak-to-peak output nonuniformities of less than 100 mV. The FPAs have been mounted in permanently-sealed vacuum packages with single-stage thermoelectric temperature stabilizers. These vacuum packages have been integrated into a camera system that has produced high-quality infrared imagery.
SBRC has developed a high-quality 320 X 240 room-temperature infrared FPA that operates in the 8 - 14 micrometers spectral band. The FPA is based upon the silicon microbolometer technology that has been licensed from Honeywell. This monolithic uncooled FPA utilizes a novel BiCMOS readout circuit that provides high sensitivity and excellent output uniformity. The 320 X 240 FPA operates at frame rates up to 60 Hz with a single output. The microbolometers were fabricated monolithically on the silicon readout circuits at SBRC using VOx as the bolometer material. An advanced microbridge structure design was used that achieves an optical fill-factor greater than 65% in the 48 micrometers X 48 micrometers pixels. The structure also provides excellent thermal isolation for high responsivity and sensitivity. Initial measurements indicate the FPAs are operating with an NETD sensitivity of about 100 mK for an f/1 aperture. This FPA is ultimately expected to operate at sensitivities of less than 20 mK. The FPA also demonstrate peak-to-peak output nonuniformities of less than 100 mV. The FPAs have been mounted in permanently-sealed vacuum packages with single- stage thermoelectric temperature stabilizers. These vacuum packages have been integrated into a camera system that has produced high-quality infrared imagery.
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