KEYWORDS: Connectors, Contamination, Particles, Temperature metrology, High power lasers, Air temperature, Reliability, Photonic integrated circuits, Optical surfaces
Co-Packaged Optics is a development of technology for high speed data switching, to be implemented widely in data center and high-performance computing architectures as a means to continue expansion of bandwidth and reduction of energy per bit. This development removes transceivers from the switch faceplate and replaces them with an optical link from the faceplate to transceiver PICs packaged on or near the ASIC switch substrate. Most approaches involve CW external lasers being carried over polarization-maintaining fiber to the PICs to be modulated for outgoing traffic. Lasers are active components with extremely high power densities and thus a relatively high failure rate, and they perform poorly at high temperatures such as prevail near the switch package. Therefore they will be remotely located or in removeable/front-panel pluggable packages that can be replaced with minimal disruption; this will require the use of optical fiber connectors. System reliability is significantly enhanced by using fewer, higher-power lasers, so very high powers are anticipated for these sources, up to and perhaps exceeding 250 mW, and any connector must be able to reliably tolerate these power levels over the lifetime of the laser or switch box. The use of expanded beam connectors reduces the optical intensity at exposed surfaces compared to PC connectors, and may mitigate some potential issues. We report on our initial studies to address this question of connector performance at these extreme conditions, with results on expanded beam single-mode connectors carrying high laser power in the O-band over many hundreds of hours.
The demand for ever-increasing system performance- channel count, bit rate and span length- is driving the development of higher-performance erbium doped fiber amplifiers (EDFAs) and the deployment of distributed Raman amplification. This in turn has driven requirements for increasing output power from the highly reliable 1420nm to 1510nm laser diodes used in the power amplifier stage(s) of EDFAs and as the basis for C- and L-band Raman amplification. Wavelength division multiplexing (WDM) of pump lasers for higher-power EDFAs and control of the gain spectrum in Raman amplification have also driven the increased need for wavelength stabilization of these devices. At the same time, tight system space constraints have driven the need for improved efficiency and thermal management as the operating currents of these devices have increased. This paper reports progress at Agere Systems in the development and manufacture of extremely high-reliability, high-power laser diode pump sources, including >300mW Fiber Bragg Grating (FBG) -stabilized and Distributed FeedBack (DFB) -based wavelength stabilized modules, for current and future-generation telecommunications systems.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.