Preliminary qualification of 3D nanoimprint process for dual damascene wiring.

Masaki Mitsuyasu; Norikazu Takeuchi; Masanori Hirose; Shunsuke Honda; Akihiko Ando; Toshiaki Komukai; Motofumi Komori; Takuya Kono

doi:10.1117/12.3010093

10 April 2024 Preliminary qualification of 3D nanoimprint process for dual damascene wiring.

Masaki Mitsuyasu, Norikazu Takeuchi, Masanori Hirose, Shunsuke Honda, Akihiko Ando, Toshiaki Komukai, Motofumi Komori, Takuya Kono

Author Affiliations +

Proceedings Volume PC12956, Novel Patterning Technologies 2024; PC129560G (2024) https://doi.org/10.1117/12.3010093
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Nanoimprint lithography (NIL) is considered to be a sustainable technology for fabricating fine patterns and 3D structure of semiconductor devices. In this paper, we report preliminary results of device qualification for dual damascene structure fabricated by NIL. We have optimized NIL conditions to improve defectivity and overlay accuracy, and etching condition to improve fidelity and uniformity of 3D shape on the entire wafer. The 1st electrical characteristic results confirm the possibilities of one step fabrication of 3D dual damascene structure using NIL

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Masaki Mitsuyasu, Norikazu Takeuchi, Masanori Hirose, Shunsuke Honda, Akihiko Ando, Toshiaki Komukai, Motofumi Komori, and Takuya Kono "Preliminary qualification of 3D nanoimprint process for dual damascene wiring.", Proc. SPIE PC12956, Novel Patterning Technologies 2024, PC129560G (10 April 2024); https://doi.org/10.1117/12.3010093

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