Presentation
21 March 2023 Optimization of bevelled mesa fabrication process for vertical GaN p-n diodes
Author Affiliations +
Abstract
Low angle bevelled-mesa structures are crucial for development of high quality GaN p-n high voltage diodes and photodetectors. However, there is lack of details of development of such a process in the literature. Here in this work, we present results of optimization of bevelled mesa fabrication process for vertical GaN p-n diodes using plasma etching through photoresist mask prepared using reflow process. Developed process of formation of low angle bevelled mesa structures was integrated in the vertical GaN p-n diodes on bulk GaN substrates fabrication process. Very low leakage current density below 10-9 A/cm2 and very high Ion/Ioff current ratio over 1013 was obtained. Low values of ideality factor down to 1.5 were obtained as well. These prove applicability of developed process in technology of vertical GaN p-n diodes on bulk gallium nitride substrates.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jarosław Tarenko, Maciej Kamiński, Renata Kruszka, Magdalena Zadura, Andrzej Taube, Marek Ekielski, Joanna Jankowska-Śliwińska, Anna Szerling, Paweł Prystawko, Michał Boćkowski, and Izabella Grzegory "Optimization of bevelled mesa fabrication process for vertical GaN p-n diodes", Proc. SPIE PC12421, Gallium Nitride Materials and Devices XVIII, (21 March 2023); https://doi.org/10.1117/12.2648891
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KEYWORDS
Gallium nitride

Diodes

Photomasks

Photoresist materials

Etching

Photoresist developing

Profilometers

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