Removal of highly crosslinked resists and hybrid polymers for single micro parts fabrication and nanoimprint stamp rework

Anja Voigt; Rainer Engelke; Gisela Ahrens; Franziska Bullerjahn; Arne Schleunitz; Jan J. Klein; Gabi Grützner

doi:10.1117/12.2046253

27 March 2014 Removal of highly crosslinked resists and hybrid polymers for single micro parts fabrication and nanoimprint stamp rework

Anja Voigt, Rainer Engelke, Gisela Ahrens, Franziska Bullerjahn, Arne Schleunitz, Jan J. Klein, Gabi Grützner

Author Affiliations +

Proceedings Volume 9051, Advances in Patterning Materials and Processes XXXI; 90511H (2014) https://doi.org/10.1117/12.2046253
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

Thick photoresists, e.g. up to 1 mm layer thickness, are widely used for the manufacture of high aspect ratio microstructures, e.g. as mould for the fabrication of metallic micro parts. Such resists or materials exhibit high mechanical and chemical stability to non-deformably withstand a pattern transfer process, e.g. by electroplating. After the pattern transfer a solvent based removal is difficult or not possible in many cases. A selective mould removal – without the damage of electroplated metal structures – is required for the fabrication of single micro parts. As second application example UV curable and strongly crosslinkable inorganic-organic hybrid polymers such as OrmoComp ® and OrmoStamp ® are used in UV moulding. The cleaning and rework of these moulds or also of stamps for nanoimprint lithography (NIL) is a challenging task with increasing importance. The life time of an expensive master mould or stamp as well as of the replicated working stamps is important, and therefore the ability to rework such stamps without any defect or decreased resolution. Hence, we demonstrate the application of a plasma-assisted removal using the STP 2020 etching tool from MUEGGE [1] for remote dry etching of strongly crosslinked materials, i.e. the development of processes for the isotropical etching of highly crosslinked photoresists and hybrid polymer materials will be presented. In combination with this specific etching tool this technique shows a high potential to make plasma-assisted removal ready for industrial production.

Citation Download Citation

Anja Voigt, Rainer Engelke, Gisela Ahrens, Franziska Bullerjahn, Arne Schleunitz, Jan J. Klein, and Gabi Grützner "Removal of highly crosslinked resists and hybrid polymers for single micro parts fabrication and nanoimprint stamp rework", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511H (27 March 2014); https://doi.org/10.1117/12.2046253

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
10 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Etching

Polymers

Nanoimprint lithography

Plasma etching

Plasma

Silicon

Dry etching

Show All Keywords

Keywords/Phrases

Search In:

Publication Years