Hot-embossing of microstructures on addition-curing polydimethylsiloxane films

Sindhu Vudayagiri; Liyun Yu; Suzan Hassouneh; Anne Ladegaard Skov

doi:10.1117/12.2009469

9 April 2013 Hot-embossing of microstructures on addition-curing polydimethylsiloxane films

Sindhu Vudayagiri, Liyun Yu, Suzan Hassouneh, Anne Ladegaard Skov

Proceedings Volume 8687, Electroactive Polymer Actuators and Devices (EAPAD) 2013; 86870S (2013) https://doi.org/10.1117/12.2009469
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2013, San Diego, California, United States

Abstract

To our knowledge no known technologies or processes are commercially available for embossing microstructures and sub-micron structures on elastomers like silicones in large scale production of films. The predominantly used technologies to make micro-scale components for micro-fluidic devices and microstructures on PDMS elastomer are 1) reaction injection molding 2) UV lithography and 3) photolithography, which all are time-consuming and not suitable for large scale productions. A hot-embossing process to impart micro-scale corrugations on an addition curing vinyl terminated PDMS (polydimethyl siloxane) film, which is thermosetting elastomer, was established based on the existing and widely applied technology for thermoplasts. We focus on hot-embossing as it is one of the simplest, most costeffective and time saving methods for replicating structures for thermoplasts. Addition curing silicones are shown to possess the ability to capture and retain an imprint made on it 10-15 minutes after the gel-point at room temperature. This property is exploited in the hot-embossing technology.

Citation Download Citation

Sindhu Vudayagiri, Liyun Yu, Suzan Hassouneh, and Anne Ladegaard Skov "Hot-embossing of microstructures on addition-curing polydimethylsiloxane films", Proc. SPIE 8687, Electroactive Polymer Actuators and Devices (EAPAD) 2013, 86870S (9 April 2013); https://doi.org/10.1117/12.2009469

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