Paper
10 April 2013 Enhancing metrology by combining spatial variability and global inference
Author Affiliations +
Abstract
Recently, there has been significant interest in so-called Hybrid or Holistic Metrology, the practice of combining measurements from multiple sources in order to improve the estimation of one or more critical parameters. There also has been significant research in capturing and modeling the hierarchical spatial variability of CDs at the die, wafer, and lot level. However, the information inherent in spatial variability models has not been used towards improving the accuracy/precision of CD estimates. In this paper, we review the current trends in Hybrid Metrology and Spatial Variability Modeling, and provide a simple example based on the work of Zhang et al.1 that illustrates how we can incorporate spatial information for improved measurement estimates.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Costas J. Spanos and Jae Yeon Baek "Enhancing metrology by combining spatial variability and global inference", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86813E (10 April 2013); https://doi.org/10.1117/12.2021912
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Cited by 1 scholarly publication.
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KEYWORDS
Metrology

Semiconducting wafers

Statistical analysis

Critical dimension metrology

Process control

Scanning electron microscopy

Scatterometry

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