Paper
20 March 2012 Resist process optimization for further defect reduction
Keiichi Tanaka, Tomohiro Iseki, Hiroshi Marumoto, Koji Takayanagi, Yuichi Yoshida, Ryouichi Uemura, Kosuke Yoshihara
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Abstract
Defect reduction has become one of the most important technical challenges in device mass-production. Knowing that resist processing on a clean track strongly impacts defect formation in many cases, we have been trying to improve the track process to enhance customer yield. For example, residual type defect and pattern collapse are strongly related to process parameters in developer, and we have reported new develop and rinse methods in the previous papers. Also, we have reported the optimization method of filtration condition to reduce bridge type defects, which are mainly caused by foreign substances such as gels in resist. Even though we have contributed resist caused defect reduction in past studies, defect reduction requirements continue to be very important. In this paper, we will introduce further process improvements in terms of resist defect reduction, including the latest experimental data.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Keiichi Tanaka, Tomohiro Iseki, Hiroshi Marumoto, Koji Takayanagi, Yuichi Yoshida, Ryouichi Uemura, and Kosuke Yoshihara "Resist process optimization for further defect reduction", Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83252L (20 March 2012); https://doi.org/10.1117/12.915813
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Cited by 4 scholarly publications.
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KEYWORDS
Semiconducting wafers

Particles

Photoresist processing

Bridges

Wafer manufacturing

Capillaries

Polymers

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