Small pixel uncooled imaging FPAs and applications

Richard Blackwell; Glen Franks; Daniel Lacroix; Sandra Hyland; Robert Murphy

doi:10.1117/12.852970

3 May 2010 Small pixel uncooled imaging FPAs and applications

Richard Blackwell, Glen Franks, Daniel Lacroix, Sandra Hyland, Robert Murphy

Proceedings Volume 7660, Infrared Technology and Applications XXXVI; 76600Y (2010) https://doi.org/10.1117/12.852970
Event: SPIE Defense, Security, and Sensing, 2010, Orlando, Florida, United States

Abstract

BAE Systems continues to make dramatic progress in uncooled microbolometer sensors and applications. This paper will review the latest advancements in microbolometer technology at BAE Systems, including the development status of 17 micrometer pixel pitch detectors and imaging modules which are entering production and will be finding their way into BAE Systems products and applications. Benefits include increased die per wafer and potential benefits to SWAP for many applications. Applications include thermal weapons sights, thermal imaging modules for remote weapon stations, vehicle situational awareness sensors and mast/pole mounted sensors.

Citation Download Citation

Richard Blackwell, Glen Franks, Daniel Lacroix, Sandra Hyland, and Robert Murphy "Small pixel uncooled imaging FPAs and applications", Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 76600Y (3 May 2010); https://doi.org/10.1117/12.852970

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