Paper
23 September 2009 Predictive modeling for EBPC in EBDW
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Abstract
We demonstrate a flow for e-beam proximity correction (EBPC) to e-beam direct write (EBDW) wafer manufacturing processes, demonstrating a solution that covers all steps from the generation of a test pattern for (experimental or virtual) measurement data creation, over e-beam model fitting, proximity effect correction (PEC), and verification of the results. We base our approach on a predictive, physical e-beam simulation tool, with the possibility to complement this with experimental data, and the goal of preparing the EBPC methods for the advent of high-volume EBDW tools. As an example, we apply and compare dose correction and geometric correction for low and high electron energies on 1D and 2D test patterns. In particular, we show some results of model-based geometric correction as it is typical for the optical case, but enhanced for the particularities of e-beam technology. The results are used to discuss PEC strategies, with respect to short and long range effects.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rainer Zimmermann, Martin Schulz, Wolfgang Hoppe, Hans-Jürgen Stock, Wolfgang Demmerle, Alex Zepka, Artak Isoyan, Lars Bomholt, Serdar Manakli, and Laurent Pain "Predictive modeling for EBPC in EBDW", Proc. SPIE 7488, Photomask Technology 2009, 74883J (23 September 2009); https://doi.org/10.1117/12.833482
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Cited by 3 scholarly publications.
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KEYWORDS
Data modeling

3D modeling

Electron beam direct write lithography

Point spread functions

Critical dimension metrology

Model-based design

Cadmium

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