New analysis tools and processes for mask repair verification and defect disposition based on AIMS images

Rigo Richter; Eric Poortinga; Thomas Scheruebl

doi:10.1117/12.835948

23 September 2009 New analysis tools and processes for mask repair verification and defect disposition based on AIMS images

Rigo Richter, Eric Poortinga, Thomas Scheruebl

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Proceedings Volume 7488, Photomask Technology 2009; 74882V (2009) https://doi.org/10.1117/12.835948
Event: SPIE Photomask Technology, 2009, Monterey, California, United States

Abstract

Using AIMS^TM to qualify repairs of defects on photomasks is an industry standard. AIMS^TM images match the lithographic imaging performance without the need for wafer prints. Utilization of this capability by photomask manufacturers has risen due to the increased complexity of layouts incorporating RET and phase shift technologies. Tighter specifications by end-users have pushed AIMS^TM analysis to now include CD performance results in addition to the traditional intensity performance results. Discussed is a new Repair Verification system for automated analysis of AIMS^TM images. Newly designed user interfaces and algorithms guide users through predefined analysis routines as to minimize errors. There are two main routines discussed, one allowing multiple reference sites along with a test/defect site within a single image of repeating features. The second routine compares a test/defect measurement image with a reference measurement image. Three evaluation methods possible with the compared images are discussed in the context of providing thorough analysis capability. This paper highlights new functionality for AIMS^TM analysis. Using structured analysis processes and innovative analysis tools leads to a highly efficient and more reliable result reporting of repair verification analysis.

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Rigo Richter, Eric Poortinga, and Thomas Scheruebl "New analysis tools and processes for mask repair verification and defect disposition based on AIMS images", Proc. SPIE 7488, Photomask Technology 2009, 74882V (23 September 2009); https://doi.org/10.1117/12.835948

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KEYWORDS

Photomasks

Image analysis

Image processing

Semiconducting wafers

Error analysis

Analytical research

Manufacturing

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