Integration of InP-based optoelectronics with silicon waveguides

Timo Aalto; Mikko Harjanne; Markku Kapulainen; Sami Ylinen; Jyrki Ollila; Ville Vilokkinen; Ludwig Mörl; Martin Möhrle; Régis Hamelin

doi:10.1117/12.808129

9 February 2009 Integration of InP-based optoelectronics with silicon waveguides

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Jyrki Ollila, Ville Vilokkinen, Ludwig Mörl, Martin Möhrle, Régis Hamelin

Author Affiliations +

Proceedings Volume 7218, Integrated Optics: Devices, Materials, and Technologies XIII; 72180O (2009) https://doi.org/10.1117/12.808129
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with Indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench.

Citation Download Citation

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Jyrki Ollila, Ville Vilokkinen, Ludwig Mörl, Martin Möhrle, and Régis Hamelin "Integration of InP-based optoelectronics with silicon waveguides", Proc. SPIE 7218, Integrated Optics: Devices, Materials, and Technologies XIII, 72180O (9 February 2009); https://doi.org/10.1117/12.808129

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