Paper
25 March 2008 Characterization of the poly gate ACI structure with laser based angle resolved multiple wavelength scatterometry
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Abstract
Optical metrology techniques are essential for process control of gate formation process steps from lithography to the dielectric, spacers, gate and straining layer deposition in sub-90nm technology nodes. Traditionally, optical metrology is based on the measurement of periodic lines or hole arrays using a spectroscopic ellipsometer or reflectometer, collecting data across a wide wavelength spectrum at a single angle of incidence. In this paper, we present results of measurements on periodic Poly-Si gate line arrays using laser based Focused Beam Scatterometry (FBS), illuminating at 3 discrete laser wavelengths while data is collected over an angle of incidence range from 45° to 65°. Accuracy, repeatability, and tool-to-tool matching results for the poly-Si gate line arrays are discussed. Comparison with the CD-SEM and cross-section TEM result for measurement/modeling accuracy is also presented.
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Gary Jiang, Michael Kotelyanskii, and Fei Shen "Characterization of the poly gate ACI structure with laser based angle resolved multiple wavelength scatterometry", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69223Q (25 March 2008); https://doi.org/10.1117/12.772615
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Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Dysprosium

Transmission electron microscopy

Semiconducting wafers

Laser scattering

Metrology

Scatterometry

Process control

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