Nano patterning fabrication by low energy microcolumn lithography

Takatoshi Yoshimoto; Seok Hyun Hwang; Kyong Hon Kim; Do Jin Seong; Dea Wook Kim; Young Chul Kim; Seung Jun Ahn; Ho Seob Kim

doi:10.1117/12.707374

9 February 2007 Nano patterning fabrication by low energy microcolumn lithography

Takatoshi Yoshimoto, Seok Hyun Hwang, Kyong Hon Kim, Do Jin Seong, Dea Wook Kim, Young Chul Kim, Seung Jun Ahn, Ho Seob Kim

Author Affiliations +

Proceedings Volume 6476, Optoelectronic Integrated Circuits IX; 647612 (2007) https://doi.org/10.1117/12.707374
Event: Integrated Optoelectronic Devices 2007, 2007, San Jose, California, United States

Abstract

Nano-pattering process by low-voltage electron beam lithography based on microcolumn with beam energy of 500 eV has been developed. Low kV exposure provides the advantages of high sensitivity, reduced charging, and a lack of proximity and heating effects. However a low-voltage electron beam has very thin penetration range. At 500 V, the penetration range is less than 20 nm, while typical resist thickness is > 200 nm. A resist process with bilayer scheme, 17 nm-thick PMMA resist on 100 nm-thick SiO₂ layer, and wet etch method was demonstrated for 250 nm line patterns transfer to Si substrate. The process was applied to fabricate periodic grating patterns on a silicon substrate. The results of nano-pattern process by low energy microcolumn lithography will be discussed in detail.

Citation Download Citation

Takatoshi Yoshimoto, Seok Hyun Hwang, Kyong Hon Kim, Do Jin Seong, Dea Wook Kim, Young Chul Kim, Seung Jun Ahn, and Ho Seob Kim "Nano patterning fabrication by low energy microcolumn lithography", Proc. SPIE 6476, Optoelectronic Integrated Circuits IX, 647612 (9 February 2007); https://doi.org/10.1117/12.707374

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