Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

Hermann H. Oppermann; Matthias Hutter; Gunter Engelmann; Herbert Reichl

doi:10.1117/12.600798

22 January 2005 Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

Hermann H. Oppermann, Matthias Hutter, Gunter Engelmann, Herbert Reichl

Proceedings Volume 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV; (2005) https://doi.org/10.1117/12.600798
Event: MOEMS-MEMS Micro and Nanofabrication, 2005, San Jose, California, United States

Abstract

Assembly of single mode laser diodes requires a post bond alignment accuracy of less than 1 μm. The implementation of passive alignment in optoelectronics packaging is still a challenge. A low cost approach to achieve such high precision alignment is using the flip chip self alignment mechanism in combination with micro-mechanical stops. In order to prove that this approach is feasible test vehicles were designed and fabricated. This paper presents the concept of passive alignment pursued, the experimental setup and results thereof. The design of the test vehicles is described including the bump design as well as bumping and flip chip assembly process.

Citation Download Citation

Hermann H. Oppermann, Matthias Hutter, Gunter Engelmann, and Herbert Reichl "Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops", Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); https://doi.org/10.1117/12.600798

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