1.3 µm U-bend traveling wave SOA devices for high efficiency coupling to silicon photonics

Jukka Viheriälä; Heidi Tuorila; Nouman Zia; Matteo Cherchi; Timo Aalto; Mircea Guina

doi:10.1117/12.2505935

4 March 2019 1.3μm U-bend traveling wave SOA devices for high efficiency coupling to silicon photonics

Jukka Viheriälä, Heidi Tuorila, Nouman Zia, Matteo Cherchi, Timo Aalto, Mircea Guina

Proceedings Volume 10923, Silicon Photonics XIV; 109230E (2019) https://doi.org/10.1117/12.2505935
Event: SPIE OPTO, 2019, San Francisco, California, United States

Abstract

We present a U-bend design for traveling wave III-V gain devices, such as semiconductor optical amplifiers and laser diodes. The design greatly simplifies the butt-coupling between the III-V chip and silicon-on-insulator photonic circuit by bringing the I/O ports on one facet. This removes the need for precise dimension control otherwise required for 2-side coupling, therefore increasing the yield of mounted devices towards 100%. The design, fabrication and characterization of the U-bend device based on Euler bend geometry is presented. The losses for a bend with a minimum bending radius of 83 μm are 1.1 dB. In addition, we present an analysis comparing the yield and coupling losses of the traditionally cleaved devices with the results that the Euler bend approach enable, with the final conclusion that the yield is improved by several times while the losses are decreased by several dB.

Conference Presentation

Citation Download Citation

Jukka Viheriälä, Heidi Tuorila, Nouman Zia, Matteo Cherchi, Timo Aalto, and Mircea Guina "1.3μm U-bend traveling wave SOA devices for high efficiency coupling to silicon photonics", Proc. SPIE 10923, Silicon Photonics XIV, 109230E (4 March 2019); https://doi.org/10.1117/12.2505935

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