Paper
18 November 2003 Laser welding of polymer micro-fluidic devices using novel diode laser sources
Anthony P. Hoult
Author Affiliations +
Proceedings Volume 5063, Fourth International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.540601
Event: Fourth International Symposium on Laser Precision Microfabrication, 2003, Munich, Germany
Abstract
The most widely used basic building block for high power diode lasers systems is a 19 emitter diode laser bar. For materials processing tasks, these may be used as single bars, can be built into vertical stacks or may be fiber coupled. For certain applications a line of light is preferred to a round beam and hence the use of fiber optic delivery may not be necessary. Straightforward optics can be used to convert the divergent output from this diode bar into a rectangle of line of focused light but the uniformity of the beam within this rectangle is a major problem. When diode bars are stacked vertically, this problem becomes 2 dimensional for anything other than a tightly focused beam. In particular, when a single bar line source is used to cover a large surface area by motion normal to the long axis of the beam, this non-uniformity creates fluctuations in intensity due to the separation between the individual emitters on the bar. This in turn causes processing problems when a laser line is used to seal multiple micro-fluidic devices. This work reports the use of a novel technique combined with conventional fiber delivered sources and novel laser line sources to tackle this problem.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anthony P. Hoult "Laser welding of polymer micro-fluidic devices using novel diode laser sources", Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); https://doi.org/10.1117/12.540601
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Semiconductor lasers

Laser welding

Compact discs

Polymers

Diodes

Laser processing

Thin films

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