Paper
6 November 2000 Micro materials processing with high-power diode lasers
Friedrich G. Bachmann, Reiji Takahashi, Susumu Fujishima
Author Affiliations +
Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000) https://doi.org/10.1117/12.405686
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan
Abstract
High power diode lasers gain considerable interest for materials processing applications, since they are very efficient, easy to use, reliable and almost service free. In contrast to conventional lasers, state-of-the-art high power diode lasers consist of a high number incoherently coupled individual semiconductor lasers, which are combined to one unit by use of semiconductor technology, micro- mechanics and micro-optics. A power range from 10 W until up to 8 kW can be covered. This paper describes the technology of diode lasers in the range between 30 and 150 W. The diode lasers have already successfully entered the industrial manufacturing area. As applications of lasers in this power range soldering and polymer welding are described in more detail.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Friedrich G. Bachmann, Reiji Takahashi, and Susumu Fujishima "Micro materials processing with high-power diode lasers", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); https://doi.org/10.1117/12.405686
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Semiconductor lasers

Polymers

Laser applications

Materials processing

High power diode lasers

Laser welding

High power lasers

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