Low-temperature joining of Zerodur and SiO2 for optical device manufacture

Samuel D. Conzone; Mark J. Davis

doi:10.1117/12.446885

2 November 2001 Low-temperature joining of Zerodur and SiO₂for optical device manufacture

Samuel D. Conzone, Mark J. Davis

Proceedings Volume 4452, Inorganic Optical Materials III; (2001) https://doi.org/10.1117/12.446885
Event: International Symposium on Optical Science and Technology, 2001, San Diego, CA, United States

Abstract

A proprietary, inorganic, sol-gel joining technique was used to fabricate Zerodur-Zerodur-SiO₂ joints at temperatures 5000 psi, regardless of the heat treatment temperature from 25 to 120 degrees C. The strength of Zerodur-SiO₂ joints was 4500 psi. The Zerodur-Zerodur joints exhibited excellent dimensional stability perpendicular to the joint interface as there was no statistically significant difference between the coefficient of thermal expansion measured for joined and monolithic samples. The inorganic, sol-gel joining technique is an attractive technology that could be employed when fabricating light-weighted, dimensionally stable mirror blanks and microlithography stages.

Citation Download Citation

Samuel D. Conzone and Mark J. Davis "Low-temperature joining of Zerodur and SiO₂for optical device manufacture", Proc. SPIE 4452, Inorganic Optical Materials III, (2 November 2001); https://doi.org/10.1117/12.446885

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