Paper
15 February 1994 Characterization of rapid thermally grown dielectrics by surface charge analysis and atomic force microscopy
John M. Grant, Lynn R. Allen
Author Affiliations +
Abstract
With the advent of Rapid Thermal Processing to produce gate dielectrics, the need for quick characterization of the dielectrics has increased. The effect of the process conditions on the dielectric quality need to be considered during process development. Pre-growth cleaning processes may also affect the quality of the dielectric material. Surface Charge Analysis (SCA) and Atomic Force Microscopy (AFM) provide measurements that may be used to aid process development. In this work, SCA and AFM have been used to examine the effects of NH4OH:H2O2:H2O cleaning on (100) silicon wafers. The data indicate a correlation between surface roughness and interface trap density, with rougher surfaces having lower densities of interface traps. Also included in this work is a SCA comparison of oxides grown using Rapid thermal Oxidation in O2 and N2O ambients.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John M. Grant and Lynn R. Allen "Characterization of rapid thermally grown dielectrics by surface charge analysis and atomic force microscopy", Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); https://doi.org/10.1117/12.167363
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Oxides

Dielectrics

Interfaces

Fractal analysis

Semiconducting wafers

Atomic force microscopy

Oxidation

RELATED CONTENT


Back to Top