Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives

Devin E. Mix; Avram Bar-Cohen

doi:10.1117/12.158598

27 September 1993 Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives

Devin E. Mix, Avram Bar-Cohen

Proceedings Volume 1999, Adhesives Engineering; (1993) https://doi.org/10.1117/12.158598
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States

Abstract

The use of loaded epoxy adhesives in the microelectronics industry is widespread. Integrated circuit (IC) chips are often adhesively bonded to die-pads, substrates, leadframes, and/or heatspreaders. In addition to silicon, a variety of adherends including IC passivation coatings (such as polyimide), copper and copper alloys (plated with precious metals and non-plated), aluminum, and ceramics (such as alumina (Al₂O₃)) are encountered in situations such as these. The adhesion strength as well as the mechanical properties of the adhesives used in these configurations are unfortunately not well known. In order to obtain an estimate of the values of the parameters that are of interest it is necessary to experimentally investigate the adhesives in the configuration under consideration. This was done for a number of commercially available loaded epoxy adhesives. A full factorial experimental study was conducted, using double lap shear test specimens (DLSTSs), in order to determine the effect of moisture and temperature on the adhesion strength of these adhesives. An Instron mechanical test system was used to generate force-displacement (F-d) curves for each of the adhesives that were studied. The adhesives that were examined consisted of both 'low stress' and high strength materials and they were obtained from four different vendors. The experimental results were also used in conjunction with a Finite Element (FE) model of the DLSTS in order to determine the non-linear Young's moduli of the adhesives as a function of strain, moisture, and temperature.

Citation Download Citation

Devin E. Mix and Avram Bar-Cohen "Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158598

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KEYWORDS

Adhesives

Glasses

Failure analysis

Copper

Silicon

Control systems

Epoxies

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