Manufacturing of 3D submicronic structures at wafer scale

Diana Fernandez Rodas; Jérôme Rêche; Ivanie Mendes; Raluca Tiron

doi:10.1117/12.3009978

9 April 2024 Manufacturing of 3D submicronic structures at wafer scale

Diana Fernandez Rodas, Jérôme Rêche, Ivanie Mendes, Raluca Tiron

Proceedings Volume 12956, Novel Patterning Technologies 2024; 129560L (2024) https://doi.org/10.1117/12.3009978
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Conference Poster

Abstract

3D patterns and miniaturization have emerged as key paths for novel applications in microelectronics, optics, photonics and more. However, the current manufacturing techniques for high-resolution 3D patterning are complex, slow, and expensive. Here, we combine grayscale electron-beam lithography (g-EBL) and nanoimprint lithography (NIL) to overcome these challenges. Indeed, g-EBL allows the fabrication of complex structures with high resolution, while NIL can replicate complex patterns down to the nanometer scale with reduced time and cost. In a first step, the master is fabricated by grayscale electron beam lithography to obtain high resolution. This "resist master" is employed to prevent possible pattern deformation caused by etching and stripping steps. In a second step, this master is replicated by NIL to increase the throughput. In addition, different characterizations are performed after each step in order to evaluate the process. The morphology, dimensions and material properties are studied.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Diana Fernandez Rodas, Jérôme Rêche, Ivanie Mendes, and Raluca Tiron "Manufacturing of 3D submicronic structures at wafer scale", Proc. SPIE 12956, Novel Patterning Technologies 2024, 129560L (9 April 2024); https://doi.org/10.1117/12.3009978

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