Increasing the dimensions of metrology

Wilhelm Maurer; Carola Blaesing-Bangert; Hans-Helmut Paul

doi:10.1117/12.20071

1 June 1990 Increasing the dimensions of metrology

Wilhelm Maurer, Carola Blaesing-Bangert, Hans-Helmut Paul

Proceedings Volume 1261, Integrated Circuit Metrology, Inspection, and Process Control IV; (1990) https://doi.org/10.1117/12.20071
Event: Microlithography '90, 1990, San Jose, CA, United States

Abstract

In any process that generates or measures pattern-placement (overlay), these parameters need to be regarded at least as two-dimensional. We show this on our procedure bringing a mask repeater under statistical process control SPC). In order to increase the accuracy of the overlay measurement process itself, plate bending has to be included as a third dimension. By taking the third dimension into account, the LMS 2000 Metrology System significantly reduces the maximum uncertainity of measurement results.

Citation Download Citation

Wilhelm Maurer, Carola Blaesing-Bangert, and Hans-Helmut Paul "Increasing the dimensions of metrology", Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); https://doi.org/10.1117/12.20071

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